| Electronic Components Datasheet Search |
|
TL074 Datasheet(PDF) 21 Page - Texas Instruments |
|
|
|||||||||||||||||||||||||||||
TL074 Datasheet(HTML) 21 Page - Texas Instruments |
|
21 / 39 page ![]() 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 -50 -25 0 25 50 75 100 125 T ( C) J ° MaxI (dc) MaxI (RMS) OUT OUT MAXIMUMOUTPUTCURRENTvsJUNCTIONTEMPERATURE OPA564 www.ti.com SBOS372E – OCTOBER 2008 – REVISED JANUARY 2011 CURRENT LIMIT FLAG Depending on load and signal conditions, the thermal protection circuit may cycle on and off. This cycling The OPA564 features a current limit flag (IFLAG) that limits the amplifier dissipation, but may have can be monitored to determine if the load current is undesirable effects on the load. Any tendency to operating within or exceeding the current limit set by activate the thermal protection circuit indicates the user. The output signal of IFLAG is compatible with excessive power dissipation or an inadequate standard CMOS logic and is referenced to the heatsink. For reliable, long-term, continuous negative supply pin (V –). A voltage level of + 0.8V or operation, with IOUT at the maximum output of 1.5A, less with respect to V – indicates that the amplifier is the junction temperature should be limited to +85 °C operating within the limits set by the user. A voltage maximum. Figure 44 shows the maximum output level of +2.0V or greater with respect to V – indicates current versus junction temperature for dc and RMS that the OPA564 is operating above (exceeds) the signal outputs. To estimate the margin of safety in a current limit set by the user. See Setting the Current complete design (including heatsink), increase the Limit for proper current limit operation. ambient temperature until the thermal protection triggers. Use worst-case loading and signal OUTPUT STAGE COMPENSATION conditions. For good, long-term reliability, thermal protection should trigger more than 35 °C above the The complex load impedances common in power op maximum expected ambient condition of the amp applications can cause output stage instability. application. For normal operation, output compensation circuitry is typically not required. However, if the OPA564 is The internal protection circuitry of the OPA564 was intended to be driven into current limit, an R/C designed to protect against overload conditions; it network (snubber) may be required. A snubber circuit was not intended to replace proper heatsinking. such as the one shown in Figure 54 may also Continuously running the OPA564 into thermal enhance stability when driving large capacitive loads shutdown degrades reliability. (greater than 1000pF) or inductive loads (for example, motors or loads separated from the amplifier by long cables). Typically, 3 Ω to 10Ω in series with 0.01mF to 0.1mF is adequate. Some variations in circuit value may be required with certain loads. OUTPUT PROTECTION The output structure of the OPA564 includes ESD diodes (see Figure 43). Voltage at the OPA564 output must not be allowed to go more than 0.4V beyond either supply rail to avoid damaging the device. Reactive and electromagnetic field (EMF)-generation loads can return load current to the amplifier, causing the output voltage to exceed the power-supply voltage. This damaging condition can be avoided with clamping diodes from the output terminal to the power supplies, as Figure 54 and Figure 44. Maximum Output Current vs Junction Figure 55 illustrate. Schottky rectifier diodes with a 3A Temperature or greater continuous rating are recommended. THERMAL PROTECTION USING TSENSE FOR MEASURING JUNCTION The OPA564 has thermal sensing circuitry that helps TEMPERATURE protect the amplifier from exceeding temperature The OPA564 includes an internal diode for junction limits. Power dissipated in the OPA564 causes the temperature monitoring. The h-factor of this diode is junction temperature to rise. Internal thermal 1.033. Measuring the OPA564 junction temperature shutdown circuitry disables the output when the die can be accomplished by connecting the TSENSE pin to temperature reaches the thermal shutdown a remote-junction temperature sensor, such as the temperature limit. The OPA564 output remains shut TMP411 (see Figure 57). down until the die has cooled sufficiently; see the Electrical Characteristics, Thermal Shutdown section. © 2008–2011, Texas Instruments Incorporated Submit Documentation Feedback 21 Product Folder Link(s): OPA564 |
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |