TL074 datasheet(24/39 Pages) TI2

24 / 39 page

Mold Compound (Epoxy)

Leadframe Die Pad

Exposed at Base of the Package

Leadframe (Copper Alloy)

(a)

DWP PowerPAD cross-section view

(b)

DWD PowerPAD cross-section view

IC (Silicon)

Die Attach (Epoxy)

Board

External Heatspreader

Power Transistor

Chip

Die

Attach

Thermal

Paste

Die

Pad

WeborSpokeVia

SolidVia

NOTRECOMMENDED

RECOMMENDED

OPA564

SBOS372E

– OCTOBER 2008 – REVISED JANUARY 2011

www.ti.com

Figure 49. Cross-Section Views

holes under the PowerPAD package should be

Bottom-Side PowerPAD Assembly Process

connected to the internal plane with a complete

1. The PowerPAD must be connected to the most

connection around the entire circumference of the

negative supply of the device, V

–.

plated through-hole.

2. Prepare the PCB with a top side etch pattern, as

7. The top-side solder mask should leave exposed

shown in the attached thermal land pattern

the terminals of the package and the thermal pad

mechanical drawing. There should be etch for the

area. The thermal pad area should leave the

leads as well as etch for the thermal land.

13mil holes exposed. The larger 25mil holes

outside the thermal pad area should be covered

3. Place the recommended number of holes (or

with solder mask.

thermal vias) in the area of the thermal pad, as

seen

the

attached

thermal

land

pattern

8. Apply solder paste to the exposed thermal pad

mechanical drawing. These holes should be

area and all of the package terminals.

13mils (.013in, or 330.2mm) in diameter. They are

9. With these preparatory steps completed, the

kept small so that solder wicking through the

PowerPAD IC is simply placed in position and run

holes is not a problem during reflow.

through the solder reflow operation as any

4. It is recommended, but not required, to place a

standard

surface-mount

component.

This

small number of the holes under the package and

processing results in a part that is properly

outside the thermal pad area. These holes

installed.

provide an additional heat path between the

For detailed information on the PowerPAD package

copper land and ground plane and are 25mils

including thermal modeling considerations and repair

(.025in, or 635mm) in diameter. They may be

procedures,

see

Technical

Brief

SLMA002,

larger because they are not in the area to be

PowerPAD Thermally Enhanced Package, available

soldered, so wicking is not a problem. This

at www.ti.com.

configuration is illustrated in the attached thermal

land pattern mechanical drawing.

5. Connect all holes, including those within the

thermal pad area and outside the pad area, to the

internal plane that is at the same voltage potential

as V

–.

6. When connecting these holes to the internal

plane, do not use the typical web or spoke via

connection methodology (as Figure 50 shows).

Web connections have a high thermal resistance

connection that is useful for slowing the heat

transfer

during

soldering

operations.

This

configuration makes the soldering of vias that

have plane connections easier. However, in this

Figure 50. Via Connection Methods

application, low thermal resistance is desired for

the most efficient heat transfer. Therefore, the

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TL074 Datasheet(PDF) 24 Page - Texas Instruments

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