ABSOLUTE MAXIMUM RATINGS

TMDS261

SIGNAL

LEVEL

STATE

DESCRIPTION

Normal operational mode for device. If LP is left floating, then a weak internal pullup to VCC

H

Normal mode

pulls it to VCC.

LP

Low-power

Device is forced into a low-power state, causing the inputs and outputs to go to a

L

mode

high-impedance state. All other inputs are ignored.

S2

S1

H

H

Port 1

Port 1 is selected as the active port; all other ports are low.

S[2:1]

H

L

Port 2

Port 2 is selected as the active port; all other ports are low.

GPIO

L

L

Disallowed

Disallowed (Indeterminate state, all terminations are disconnected)

mode

HPD[1:2] follow

L

H

Standby mode: HPD[1:2] follow HPD_sink.

HPD_SINK

L

I2C_SEL

Device is configured by GPIO. If the I2C_SEL pin is left floating, then a weak internal pullup to

H

GPIO

VCC pulls the I2C_SEL pin high.

Driver output voltage swing precision control to aid with system compliance. The VSadj

Compliant

VSadj

4.02 k

Ω

resistor value can be selected to be 4.02 k

Ω ±10% based on the system requirement to pass

voltage

HDMI compliance.

(1)

(H) Logic high; (L) Logic low

PART NUMBER

PART MARKING

PACKAGE

TMDS261PAGR

TMDS261

64-pin TQFP reel (large)

TMDS261PAGT

TMDS261

64-pin TQFP reel (small)

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

over operating free-air temperature range (unless otherwise noted)

(1)

VALUE

UNIT

VCC

–0.3 to 3.6

V

Voltage range

TMDS I/O

–0.3 to 4

HPD and DDC I/O

–0.3 to 5.5

V

Control and status I/O

–0.3 to 5.5

Electrostatic discharge

±10,000

D[0:2]–_[1:2], CLK+_[1:2], CLK–_[1:2] pins

±9,000

V

±1500

±200

±8,000

±15,000

Continuous power dissipation

See Dissipation Ratings table

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values, except differential voltages, are with respect to network ground terminal.

(3)

Tested in accordance with JEDEC Standard 22, Test Method A114-B

(4)

Tested in accordance with JEDEC Standard 22, Test Method C101-A

(5)

Tested in accordance with JEDEC Standard 22, Test Method A115-A

(6)

Tested in accordance with IEC EN 61000-4-2

8

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