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MPC8360E Datasheet(PDF) 30 Page - Freescale Semiconductor, Inc

Part # MPC8360E
Description  PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
PDF  108 Pages
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Manufacturer  FREESCALE [Freescale Semiconductor, Inc]
Direct Link  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

MPC8360E Datasheet(HTML) 30 Page - Freescale Semiconductor, Inc

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MPC8360E/MPC8358E PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 4
30
Freescale Semiconductor
UCC Ethernet Controller: Three-Speed Ethernet, MII Management
Figure 10 shows the GMII transmit AC timing diagram.
Figure 10. GMII Transmit AC Timing Diagram
8.2.1.2
GMII Receive AC Timing Specifications
Table 28 provides the GMII receive AC timing specifications.
GTX_CLK clock fall time, (80% to 20%)
tGTXF
——
1.0
ns
—
GTX_CLK125 clock period
tG125
—8.0
—
ns
2
GTX_CLK125 reference clock duty cycle measured at
LVDD/2
tG125H/tG125
45
—
55
%
2
Notes:
1. The symbols used for timing specifications follow the pattern t(first two letters of functional block)(signal)(state)(reference)(state) for inputs
and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tGTKHDV symbolizes GMII transmit timing
(GT) with respect to the tGTX clock reference (K) going to the high state (H) relative to the time date input signals (D) reaching
the valid state (V) to state or setup time. Also, tGTKHDX symbolizes GMII transmit timing (GT) with respect to the tGTX clock
reference (K) going to the high state (H) relative to the time date input signals (D) going invalid (X) or hold time. Note that, in
general, the clock reference symbol representation is based on three letters representing the clock of a particular functional.
For example, the subscript of tGTX represents the GMII(G) transmit (TX) clock. For rise and fall times, the latter convention is
used with the appropriate letter: R (rise) or F (fall).
2. This symbol is used to represent the external GTX_CLK125 signal and does not follow the original symbol naming
convention.
3. In rev. 2.0 silicon, due to errata, tGTKHDX minimum and tGTKHDV maximum are not supported when the GTX_CLK is selected.
Refer to Errata
QE_ENET18 in Chip Errata for the MPC8360E, Rev. 1.
Table 28. GMII Receive AC Timing Specifications
At recommended operating conditions with LVDD/OVDD of 3.3 V ± 10%.
Parameter/Condition
Symbol1
Min
Typ
Max
Unit
Notes
RX_CLK clock period
tGRX
—8.0
—
ns
—
RX_CLK duty cycle
tGRXH/tGRX
40
—
60
%
—
RXD[7:0], RX_DV, RX_ER setup time to RX_CLK
tGRDVKH
2.0
—
—
ns
—
RXD[7:0], RX_DV, RX_ER hold time to RX_CLK
tGRDXKH
0.2
—
—
ns
2
RX_CLK clock rise time, (20% to 80%)
tGRXR
——
1.0
ns
—
Table 27. GMII Transmit AC Timing Specifications (continued)
At recommended operating conditions with LVDD/OVDD of 3.3 V ± 10%.
Parameter/Condition
Symbol1
Min
Typ
Max
Unit
Notes
GTX_CLK
TXD[7:0]
tGTKHDX
tGTX
tGTXH
tGTXR
tGTXF
TX_EN
TX_ER



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