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FDG326P Datasheet(PDF) 2 Page - Texas Instruments

Part # FDG326P
Description  Triple-Supply Power Management IC for Powering FPGAs and DSPs
PDF  29 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

FDG326P Datasheet(HTML) 2 Page - Texas Instruments

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TPS75003-EP
SGLS311A
– DECEMBER 2006 – REVISED MARCH 2011
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION(1)
PRODUCT
VOUT
Buck1: Adjustable
TPS75003MRHLREP
Buck2: Adjustable
LDO: Adjustable
(1)
For the most current specifications and package information, see the Package Option Addendum located at the end of this document or
see the Texas Instruments website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
TPS75003
UNIT
VINX range (IN1, IN2, IN3)
-0.3 to +7
V
VENX range (EN1, EN2, EN3)
-0.3 to VINX + 0.3
V
VSWX range (SW1, SW2, SW3)
-0.3 to VINX + 0.3
V
VISX range (IS1, IS2, IS3)
-0.3 to VINX + 0.3
V
VOUT3 range
-0.3 to +7
V
VSSX range (SS1, SS2, SS3)
-0.3 to VINX + 0.3
V
VFBX range (FB1, FB2, FB3)
-0.3 to +3.3
V
Peak LDO output current (IOUT3)
Internally limited
—
Continuous total power dissipation
See the Thermal Information Table
—
Junction temperature range, TJ
-55 to +150
°C
Storage temperature range
-65 to +150
°C
ESD rating, HBM
1
kV
ESD rating, CDM
500
V
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under the Electrical Characteristics
is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
2
Copyright
© 2006–2011, Texas Instruments Incorporated
Product Folder Link(s): TPS75003-EP



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