DSPIC33FJ06GS201TESLASHMM datasheet(286/346 Pages) MICROCHIP

286 / 346 page

dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04

DS70318D-page 284

Preliminary

24.1

DC Characteristics

TABLE 24-1:

OPERATING MIPS VS. VOLTAGE

Characteristic

VDD Range

(in Volts)

Temp Range

(in °C)

Max MIPS

dsPIC33FJ06GS101/X02 and

dsPIC33FJ16GSX02/X04

3.0-3.6V

-40°C to +85°C

3.0-3.6V

-40°C to +125°C

TABLE 24-2:

THERMAL OPERATING CONDITIONS

Rating

Symbol

Min

Typ

Max

Unit

Industrial Temperature Devices

Operating Junction Temperature Range

-40

—

+125

°C

Operating Ambient Temperature Range

-40

—

+85

°C

Extended Temperature Devices

Operating Junction Temperature Range

-40

—

+140

°C

Operating Ambient Temperature Range

-40

—

+125

°C

Power Dissipation:

Internal chip power dissipation:

PINT = VDD x (IDD –

Σ IOH)

PINT + PI/O

I/O Pin Power Dissipation:

I/O =

Σ ({VDD – VOH} x IOH) + Σ (VOL x IOL)

Maximum Allowed Power Dissipation

PDMAX

(TJ – TA)/

θJA

TABLE 24-3:

THERMAL PACKAGING CHARACTERISTICS

Characteristic

Symbol

Typ

Max

Unit

Notes

Package Thermal Resistance, 44-Pin QFN

θJA

—

°C/W

Package Thermal Resistance, 44-Pin TFQP

θJA

—

°C/W

Package Thermal Resistance, 28-Pin SPDIP

θJA

—

°C/W

Package Thermal Resistance, 28-Pin SOIC

θJA

—

°C/W

Package Thermal Resistance, 28-Pin QFN-S

θJA

—

°C/W

Package Thermal Resistance, 18-Pin SOIC

θJA

—

°C/W

Note 1:

Junction to ambient thermal resistance, Theta-JA (

θJA) numbers are achieved by package simulations.

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