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STM8S005C6T6 Datasheet(PDF) 97 Page - STMicroelectronics |
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STM8S005C6T6 Datasheet(HTML) 97 Page - STMicroelectronics |
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97 / 103 page ![]() Thermal characteristics 11 The maximum chip junction temperature (TJ max) must never exceed the values given in Operating conditions The maximum chip-junction temperature, TJmax, in degrees Celsius, may be calculated using the following equation: TJmax = TAmax + (PDmax x ΘJA) Where: • TAmax is the maximum ambient temperature in °C • ΘJA is the package junction-to-ambient thermal resistance in ° C/W • PDmax is the sum of PINTmax and PI/Omax(PDmax = PINTmax + PI/Omax) • PINTmax is the product of IDDandVDD, expressed in Watts. This is the maximum chip internal power. • PI/OmaxrepresentsthemaximumpowerdissipationonoutputpinsWhere:PI/Omax=Σ(VOL*IOL) + Σ((VDD-VOH)*IOH), taking into account the actual VOL/IOL and VOH/IOH of the I/Os at low and high level in the application. Table 52: Thermal characteristics (1) Unit Value Parameter Symbol °C/W 57 Thermal resistance junction-ambient LQFP 48 - 7 x 7 mm ΘJA °C/W 60 Thermal resistance junction-ambient LQFP 32 - 7 x 7 mm ΘJA 1. Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural convection environment. Reference document 11.1 JESD51-2 integrated circuits thermal test method environment conditions - natural convection (still air). Available from www.jedec.org. Selecting the product temperature range 11.2 When ordering the microcontroller, the temperature range is specified in the order code. The following example shows how to calculate the temperature range needed for a given application. Assuming the following application conditions: • Maximum ambient temperature TAmaz = 82 °C (measured according to JESD51-2) • IDDmax = 15 mA, VDD = 5.5 V 97/103 DocID022186 Rev 3 Thermal characteristics STM8S005K6 STM8S005C6 |
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