ML9058E datasheet(65/76 Pages) ETC2

65 / 76 page

FEDL9058E-01

LAPIS Semiconductor

ML9058E

65/76

ML9058E GOLD BUMP SPECIFICATION

Gold Bump Specification

Symbo

Parameter

Min.

Typ.

Max.

Unit

Bump Pitch (Min.Section: Segment Section)

—

m

Bump Size (Segment Section: Pitch Direction)

m

Bump Size (Segment Section: Depth Direction)

114

117

120

m

Bumo-to-Bump Distance

(Segment Section: Pitch Direction)

m

Bump Pitch (Min.Section: Input Section)

—

m

Bump Size (Input Section: Pitch Direction)

m

Bump Size (Input Section: Depth Direction)

m

Bumo-to-Bump Distance

(Input Section: Pitch Direction)

m

Bump Size (Figure “L” alignment mark: Length)

101

m

Bump Size (Figure “L” alignment mark: Width)

m

—

Pad center to Bump center allowable error

—

m

Bump Height

m

—

Bumph Height Dispersion Inside Chip (Range)

—

m

Bump Edge Height

—

m

—

Shear Strength (g)

—

Bump hardness: High (Hv: 25g load)

—

110

—

Bump hardness: Low (Hv: 25g load)

—

 Chip Thickness: 625 15 m

 Chip Size: 9.164mm  2.982mm

Top View and Cross Section View

Segment

Section

Cross Section View

Figure “L”

Alignment Mark

Input Section

ML9058E Datasheet(PDF) 65 Page - List of Unclassifed Manufacturers

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