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AN3031 Datasheet(PDF) 14 Page - STMicroelectronics

Part # AN3031
Description  SCLT3-8 input termination demonstration board
PDF  28 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

AN3031 Datasheet(HTML) 14 Page - STMicroelectronics

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Demonstration board PCB layout
AN3031
14/28
Doc ID 16144 Rev 1
3
Demonstration board PCB layout
3.1
EMC optimal PCB considerations
The following section provides basic instructions on how to implement an EMC optimized
PCB layout.
It is necessary to filter the SPI signals close to each SCLT3-8BT8 chip to prevent noise
spikes that trigger the SCK, CS or influence the data line. Single integration R-C cells are
sufficient. The R-C values should be chosen according to the requested baud rate. For
example, given a 220
Ω resistor and a ceramic capacitor with a value of:
a)
100 pF
b)
220 pF
c)
470 pF
the corresponding maximum communication frequency in the STEVAL-IFP007V1
application structure is:
a)
3 MHz
b)
1.6 MHz
c)
870 kHz
The route length should be minimized.
The path between the input signal terminals through input resistors to the filtering capacitors
should also be as short as possible. The SCLT3-8BT8 also embeds digital filters to reduce
accidental pulses (or “glitches”) entering the input lines. The use of capacitive filters is
recommended in addition to improve overall application EMC immunity.
The main reason is to establish a capacitive coupling between the input signals and GND
(which is a reference for all the application signals on the primary side).
Practical experience with several PCB design revisions has shown that application immunity
is substantially influenced by routing shape and the copper pours. Extending the board to
four routing layers improved EMC performance. The outer (top and bottom) layers are used
for signal routing. Moreover, they use copper pours surrounding the primary (SCLT) and
secondary (microcontroller) part. The inner layers are used to distribute GND, VCC and
VREG potentials. The layouts of the different layers are shown in Figures 9 to 12.
The consequence of such a structure is maximized capacitive coupling between all the
signals vs. GND reference. Therefore, all noise influencing any signal (input, supply voltage)
is eliminated and has a common mode effect.
An empty isolation space (without routes, copper areas and components) is implemented
between the primary and secondary application parts. Due to the isolator (optocoupler)
sensitivity on fast common mode transitions, both application sections could be additionally
coupled with high voltage ceramic capacitors. This increases overall application robustness.
EMC tests show immunity increases when a 10 pF capacitor has been placed between
SGND and MICRO_GND.



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