DP83848JSQSLASHNOPB datasheet(75/84 Pages) TI1

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PHY

Component

Optional 0 :

or Bead

Ground Pin

Vdd

PCB Via

Vdd

PCB

Via

0.1 PF

DP83848H, DP83848J, DP83848K, DP83848M, DP83848T

www.ti.com

SNLS250E – MAY 2008 – REVISED APRIL 2015

7.4

Power Supply Recommendations

The device VDD supply pins should be bypassed with low-impedance 0.1-μF surface mount capacitors. To

reduce EMI, the capacitors should be places as close as possible to the component VDD supply pins,

preferably between the supply pins and the vias connecting to the power plane. In some systems it may

be desirable to add 0-

Ω resistors in series with supply pins, as the resistor pads provide flexibility if adding

EMI beads becomes necessary to meet system level certification testing requirements. (See Figure 7-14)

It is recommended the PCB have at least one solid ground plane and one solid VDD plane to provide a low

impedance power source to the component. This also provides a low impedance return path for non-

differential digital MII and clock signals. A 10.0-

μF capacitor should also be placed near the PHY

component for local bulk bypassing between the VDD and ground planes.

Figure 7-16. VDD Bypass Layout

Application, Implementation, and Layout

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Product Folder Links: DP83848H DP83848J DP83848K DP83848M DP83848T

DP83848JSQ/NOPB Datasheet(PDF) 75 Page - Texas Instruments