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TMS320C6472ECTZ Datasheet(PDF) 264 Page - Texas Instruments |
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TMS320C6472ECTZ Datasheet(HTML) 264 Page - Texas Instruments |
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264 / 269 page ![]() TMS320C6472 SPRS612G – JUNE 2009 – REVISED JULY 2011 www.ti.com 8 Mechanical Data 8.1 Thermal Data Table 8-1 shows the thermal resistance characteristics for the PBGA - CTZ/ZTZ mechanical package. Table 8-1. Thermal Resistance Characteristics (S-PBGA Package) [CTZ/ZTZ] AIR FLOW NO. °C/W (lfm)(1) 1 R ΘJC Junction-to-case 0.56 N/A 2 R ΘJB Junction-to-board 5.1 N/A 3 12.9 0 4 9.9 150 R ΘJA Junction-to-free air 5 8.5 250 6 7.3 500 0.027 0 0.028 150 7 PsiJT Junction-to-package top 0.028 250 0.029 500 (1) lfm = linear feet per minute. 8.2 Packaging Information The following packaging information reflects the most current released data available for the designated device. This data is subject to change without notice and without revision of this document. 264 Mechanical Data Copyright © 2009–2011, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s) :TMS320C6472 |
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