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MICRF229 Datasheet(PDF) 12 Page - Micrel Semiconductor

Part # MICRF229
Description  400MHz to 450MHz ASK/OOK Receiver with Auto-Poll and RSSI
PDF  23 Pages
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Manufacturer  MICREL [Micrel Semiconductor]
Direct Link  http://www.micrel.com
Logo MICREL - Micrel Semiconductor

MICRF229 Datasheet(HTML) 12 Page - Micrel Semiconductor

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Micrel, Inc.
MICRF229
April 15, 2015
12
Revision 1.0
AGC Loop
The AGC comparator monitors the signal amplitude from
the output of the programmable low-pass filter. The AGC
loop in the chip regulates the signal at this point to be at a
constant level when the input RF signal is within the AGC
loop dynamic range (about
−115dBm to −40dBm).
When the chip first turns on, the fast charge feature
charges the AGC node up with 120µA typical current.
When the voltage on AGC increases, the gains of the
mixer and IF amplifier go up, increasing the amplitude of
the audio signal (as labeled in the Functional Diagram),
even with only thermal noise at the LNA input.
The fast-charge current is disabled when the audio signal
crosses the slicing threshold, causing DO to go high, for
the first time.
When an RF signal is applied, a fast-attack period
ensues, when 600µA current discharges the AGC node
to reduce the gain to a proper level. Once the loop
reaches equilibrium, the fast attack current is disabled,
leaving only 15µA to discharge AGC or 1.5µA to charge
AGC. The fast attack current is enabled only when the
RF signal increases faster than the ability of the AGC
loop to track it.
The ability of the chip to track to a signal that decreased
in strength is much slower, since only 1.5
μA is available
to charge AGC to increase the gain. When designing a
transmitter that communicates with the MICRF229,
ensure that the power level remains constant throughout
the transmit burst.
The value of AGC impacts the time to good data (TTGD),
which is defined as the time when signal is first applied,
to when the pulse width at DO is within 10% of the steady
state value. The optimal value of AGC depends on the
setting of the D4 and D3 bits.
A smaller AGC value does NOT always result in a shorter
TTGD. This is due to the loop dynamics, the fast
discharge current being 600µA, and the charge current
being only 1.5µA. For example, if D4 = D3 = 0, the low
pass filter bandwidth is set to a minimum and AGC
capacitance is too small, TTGD will be longer than if AGC
capacitance is properly chosen. This is because when
the RF signal first appears, the fast discharge period will
reduce VAGC very fast, lowering the gain of the mixer and
IF amplifier.
But since the low pass filter bandwidth is
low, it takes too long for the AGC comparator to see a
reduced level of the audio signal, so it cannot stop the
discharge current. This causes an undershoot in AGC
voltage and a corresponding overshoot in RSSI voltage.
Once AGC undershoots, it takes a long time for it to
charge back up because the current available is only
1.5µA.
Table 4 lists the recommended minimum AGC values for
different D[4:3] settings to insure that the voltage on AGC
does not undershoot. The recommendation also takes
into account the behavior in auto-polling. If AGC is too
small, the chip can have a tendency to false wake up (DO
releases even when there is no input signal).
Table 4. Minimum Suggested AGC Values
D4
D3
AGC value
0
0
4.7
μF
0
1
2.2
μF
1
0
1
μF
1
1
1
μF
Figure 3 illustrates what occurs if AGC is too small for a
given D[4:3] setting. Here, D[4:3] = 01, AGC = 0.47
μF,
and the RF input level is stepped from no signal to
−100dBm.
RSSI voltage is shown instead of AGC
voltage because RSSI is a buffered version of AGC (with
an inversion and amplification). Probing AGC directly can
affect the loop dynamics through resistive loading from a
scope probe, especially in the state where only 1.5
μA is
available, whereas probing RSSI does not. When the RF
signal is first applied, RSSI voltage overshoots due to the
fast discharge current on AGC, and the loop is too slow
to stop this fast discharge current in time. Since the
voltage on AGC is too low, the audio signal level is lower
than the slicing threshold (voltage on CTH), and DO is
low. Once the fast discharge current stops, only the small
1.5µA charge current is available in settling the AGC loop
to the correct level, causing the recovery from AGC
undershoot/RSSI overshoot condition to be slow. As a
result, TTGD is about 9.1ms. It is recommended that
Tantalum caps or high voltage ceramic cap is used for
AGC to minimize capacitor leakage current which may
affect the performance of the AGC.
Figure 3. RSSI Overshoot and Slow TTGD (9.1ms)



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