FLASH

AS8FLC2M32

AS8FLC2M32B

Rev. 1.6 05/11

Micross Components reserves the right to change products or specifications without notice.

1

FIGURE 1: PIN ASSIGNMENT

(Top View)

Hermetic, Multi-Chip Module

(MCM)

64Mb, 2M x 32, 3.3Volt Boot Block FLASH Array

Available via Applicable Specifications:

•

MIL-PRF-38534, Class H

•

DSCC SMD 5962-08245

FEATURES

•

64Mb device, total density, organized as 2M x 32

•

Bottom Boot Block (Sector) Architecture

(Contact factory for top boot)

•

Operation with single 3.0V Supply

•

Available in multiple Access time variations

•

Individual byte control via individual byte selects (CSx\)

•

Low Power CMOS

•

1,000,000 Erase/Program Cycles

•

Minimum 1,000,000 Program/Erase Cycles per sector

guaranteed

•

Sector Architecture:

•

One 16K byte, two 8K byte, one 32K byte and

thirty-one 64Kbyte sectors (byte mode)

•

Any combination of sectors can be concurrently erased

•

MCM supports full array (multi-chip) Erase

•

Embedded Erase and Program Algorithms

•

Erase Suspend/Resume; Supports reading data from or

programming data to a sector not being Erased

•

TTL Compatible Inputs and Outputs

•

Military and Industrial operating temperature ranges

OPTION

MARKING

Access Speed

70ns*

-70

90ns

-90

100ns

-100

120ns

-120

*Contact Factory

Package

Ceramic Quad Flat Pack

Q

Ceramic Hex Inline Pack

P

Temperature Range

Full Mil (MIL-PRF-38534, Class H /Q

/XT

/IT

GENERAL DESCRIPTION

The AS8FLC2M32B is a 64Mb FLASH Multi-Chip Module

organized as 2M x 32 bits. The module achieves high speed

access, low power consumption and high reliability by employ-

ing advanced CMOS memory technology. The military grade

product is manufactured in compliance to the MIL-PRF-38534

specifications, making the AS8FLC2M32B ideally suited for

military or space applications. The module is offered in a

68-lead 0.990 inch square ceramic quad flat pack or 66-lead

1.185inch square ceramic Hex In-line Package (HIP). The

CQFP package design is targeted for those applications, which

require low profile SMT Packaging.

For more products and information

please visit our web site at

www.micross.com

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66 HIP

Pin Assignment

[Package Designator H]

(Top View)

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