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AS8FLC2M32 Datasheet(PDF) 24 Page - Micross Components

Part # AS8FLC2M32
Description  Available in multiple Access time variations
PDF  29 Pages
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Manufacturer  MICROSS [Micross Components]
Direct Link  http://www.micross.com
Logo MICROSS - Micross Components

AS8FLC2M32 Datasheet(HTML) 24 Page - Micross Components

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AS8FLC2M32
AS8FLC2M32B
Rev. 1.6 05/11
Micross Components reserves the right to change products or specifications without notice.
24
Erase and Programming Performance
Typ
1
Max
2
Unit
Comments
0.5
10
s
16
s
6
150
μs
Excludes system level overhead
5
Parameter
Sector Erase Time
Chip Erase Time
Byte Programming Time
Excludes 00h programming prior
to erasure
4
NOTES
1.Typical program and erase times assume the following conditions: 25°C, VCC = 3.0 V, 100,000 cycles, checkerboard data
pattern.
2.Under worst case conditions of 90°C, VCC = 2.7 V, 1,000,000 cycles.
3.The typical chip programming time is considerably less than the maximum chip programming time listed, since most bytes
program faster than the maximum program times listed.
4.In the pre-programming step of the Embedded Erase algorithm, all bytes are programmed to 00h before erasure.
5.System-level overhead is the time required to execute the two- or four-bus-cycle sequence for the program command.
6.The device has a minimum erase and program cycle endurance of 100,000 cycles per sector.
Hardware Reset (RESET\)
JEDEC
Std
tREADY
20
μs
tREADY
500
max
All Speed Options
RESET# Pin Low (During Embedded Algorithms) to
Read or Write (See Note)
RESET# Pin Low (NOT During Embedded Algorithms)
Unit
Test Setup
Parameter
Description
tREADY
500
tRP
500
tRH
50
tRPD
20
μs
min
ns
(g
g
)
to Read or Write (See Note)
RESET# Pulse Width
RESET# High Time Before Read (See Note)
RESET# Low to Standby Mode
Note:
Not 100% Tested



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