MB9B320M datasheet(103/108 Pages) CYPRESS

103 / 108 page

Document Number: 002-05652 Rev. *D

Page 103 of 108

MB9B320M Series

Package Type

Package Code

FBGA 96

FDG096

N IS THE NUMBER OF POPULATED SOLDER BALL POSITIONS FOR MATRIX

WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE OUTER ROW,

WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE OUTER ROW,

DEFINE THE POSITION OF THE CENTER SOLDER BALL IN THE OUTER ROW.

"SD" AND "SE" ARE MEASURED WITH RESPECT TO DATUMS A AND B AND

SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE "E" DIRECTION.

SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D" DIRECTION.

"e" REPRESENTSTHE SOLDER BALL GRID PITCH.

DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL DIAMETER IN A

SOLDER BALL POSITION DESIGNATIO

N PER JEP95, SECTION 3, SPP-020.

"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED SOLDER

A1 CORNER TO BE IDENTIFIED BY

CHAMFER, LASER OR INK MARK

NOTES:

1. ALL DIMENSIONS ARE IN MILLIMETERS.

0.20

0.00

0.50 BSC

0.30

0.40

DIMENSIONS

SYMBOL

0.15

MIN.

5.00 BSC

6.00 BSC

NOM.

1.30

0.35

MAX.

0.00

0.25

METALIZED MARK, INDENTATION OR OTHER MEANS.

"SD" = eD/2 AND "SE" = eE/2.

PLANE PARALLEL TO DATUM C.

"SD" OR "SE" = 0.

SIZE MD X ME.

BALLS.

0.20 C

INDEX MARK

PIN A1

CORNER

96xφb

0.05

C A B

SIDE VIEW

0.20 C

0.08 C

DETAIL A

BOTTOM VIEW

TOP VIEW

DETAIL A

6.0X6.0X1.3 MM FDG096 REV**

PACKAGE OUTLINE, 96 BALL FBGA

002-13224 **

MB9B320M Datasheet(PDF) 103 Page - Cypress Semiconductor

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