VSC8504-02 datasheet(126/131 Pages) MICROSEMI

126 / 131 page

Package Information

VMDS-10507 VSC8504-02 Datasheet Revision 4.2

115

PCB). For more information about the thermal measurement method used for this device, see the

JESD51-1 standard.

To achieve results similar to the modeled thermal measurements, the guidelines for board design

described in the JESD51 family of publications must be applied. For information about applications using

BGA packages, see the following:

•

JESD51-2A, Integrated Circuits Thermal Test Method Environmental Conditions, Natural Convection

(Still Air)

•

JESD51-6, Integrated Circuit Thermal Test Method Environmental Conditions, Forced Convection

(Moving Air)

•

JESD51-8, Integrated Circuit Thermal Test Method Environmental Conditions, Junction-to-Board

•

JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements

7.3

Moisture Sensitivity

This device is rated moisture sensitivity level 4 as specified in the joint IPC and JEDEC standard

IPC/JEDEC J-STD-020. For more information, see the IPC and JEDEC standard.

Table 135 •

Thermal Resistances

Symbol

°C/W

Parameter

θJCtop

5.9

Die junction to package case top

θJB

12.7

Die junction to printed circuit board

θJA

Die junction to ambient

θJMA at 1 m/s

18.5

Die junction to moving air measured at an air speed of 1 m/s

θJMA at 2 m/s

16.3

Die junction to moving air measured at an air speed of 2 m/s

VSC8504-02 Datasheet(PDF) 126 Page - Microsemi Corporation