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845GL Datasheet(PDF) 170 Page - Intel Corporation |
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845GL Datasheet(HTML) 170 Page - Intel Corporation |
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170 / 193 page  Ballout and Package Information 170 Intel® 82845G/82845GL/82845GV GMCH Datasheet 7.2 Package Information The GMCH is in a 37.5 mm x 37.5 mm FC-BGA package with 1 mm ball pitch. Figure 7-3 and Figure 7-4 show the package dimensions. Figure 7-3. Intel® 82845G GMCH Package Dimensions (Top and Side Views) Units = Millimeters 1.08 ±0.06 Die 0.200 A Side View Substrate 0.500 ±0.070 See Detail D 37.50 ±0.050 Top View 37.50 ±0.05 17.9250 16.9500 Detail A Detail A Detail B Detail C 18.75 0.57 ±0.1 0.57 ±0.1 1.5 ±0.05 Detail C 3 x 0.07 Detail D 0.74 ±0.025 0.100 ±0.025 Die Solder Bumps Underfill Epoxy ϕ 0.6500 ±0.05 ϕ 0.500 Detail A A C 0.203 B ϕ 1.1500 ±0.05 ϕ 1.00 Detail B A C 0.203 B 18.75 17.9250 16.9500 |
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