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FS32K148HEX0MLFT Datasheet(PDF) 30 Page - NXP Semiconductors |
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FS32K148HEX0MLFT Datasheet(HTML) 30 Page - NXP Semiconductors |
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30 / 101 page ![]() 3. For reset pads, same Vil levels are applicable 4. The value given is measured at high drive strength mode. For value at low drive strength mode see the Ioh_Standard value given above. 5. For refernce only. Run simulations with the IBIS model and custom board for accurate results. 6. Typical leakage is given at room temperature. Maximum is given for 125°C. Leakage numbers increase with temperature, approximately every 12 – 14°C the value doubles. Leakage is tested at hot temperature. We ensure maximums are not exceeded. Please note that when the ADC module samples a pin, additional currents beyond the leakage number are drawn to charge the sample and hold capacitances and internal analog busses. These are difficult to predict 7. Several I/O have both high drive and normal drive capability selected by the associated Portx_PCRn[DSE] control bit. All other GPIOs are normal drive only. For details see IO Signal Description Input Multiplexing sheet(s) attached with the Reference Manual. 8. When using ENET and SAI on S32K148, the overall device limits associated with high drive pin configurations must be respected i.e. On 144-pin LQFP the general purpose pins: PTA10, PTD0, and PTE4 must be set to low drive. 9. Measured at input V = VSS 10. Measured at input V = VDD Table 18. DC electrical specifications at 3.3 V Range for S32K14xW series Symbol Parameter Value Unit Notes Min. Typ. Max. VDD I/O Supply Voltage 3.13 3.3 4 V Vih Input Buffer High Voltage 0.7 × VDD — VDD + 0.3 V 1 Vil Input Buffer Low Voltage VSS − 0.3 — 0.3 × VDD V 2 Vhys Input Buffer Hysteresis 0.06 × VDD — — V IohGPIO IohGPIO-HD_DSE_0 I/O current source capability measured when pad Voh = (VDD − 0.8 V) 3.5 — — mA IolGPIO IolGPIO-HD_DSE_0 I/O current sink capability measured when pad Vol = 0.8 V 3 — — mA IohGPIO-HD_DSE_1 I/O current source capability measured when pad Voh = (VDD − 0.8 V) 14 — — mA 3 IolGPIO-HD_DSE_1 I/O current sink capability measured when pad Vol = 0.8 V 12 — — mA 3 IOHT Output high current total for all ports — — 100 mA IIN Input leakage current (per pin) for full temperature range at VDD = 3.3 V 4 All pins other than high drive port pins 0.005 0.5 μA High drive port pins (excluding XTAL pin) 0.010 0.5 μA XTAL pin (PTB6) temperature ≤ 125° C 0.010 0.5 μA XTAL pin (PTB6) temperature ≥ 125° C 1.1 μA RPU Internal pullup resistors 20 60 kΩ 5 RPD Internal pulldown resistors 20 60 kΩ 6 1. For reset pads, same Vih levels are applicable 2. For reset pads, same Vil levels are applicable 3. The value given is measured at high drive strength mode. For value at low drive strength mode see the Ioh_Standard value given above. 4. Several I/O have both high drive and normal drive capability selected by the associated Portx_PCRn[DSE] control bit. All other GPIOs are normal drive only. For details see IO Signal Description Input Multiplexing sheet(s) attached with the Reference Manual. 5. Measured at input V = VSS 6. Measured at input V = VDD I/O parameters S32K1xx Data Sheet, Rev. 14, 08/2021 30 NXP Semiconductors |
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