FS32K148HEX0MLFT datasheet(84/101 Pages) NXP

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FS32K148HEX0MLFT Datasheet(PDF) 84 Page - NXP Semiconductors

Part #	FS32K148HEX0MLFT

Description	Low-power Arm Cortex-M4F/M0 core with excellent energy efficiency

PDF	101 Pages

Scroll/Zoom	100%

Manufacturer	NXP [NXP Semiconductors]

Direct Link	http://www.nxp.com

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84 / 101 page

J12

J10

J11

Input data valid

Output data valid

TCLK

TDI/TMS

TDO

J14

TDO

J13

Figure 35. Test Access Port timing

Thermal attributes

7.1 Description

The tables in the following sections describe the thermal characteristics of the device.

NOTE

Junction temperature is a function of die size, on-chip power

dissipation, package thermal resistance, mounting side (board)

temperature, ambient temperature, air flow, power dissipation

or other components on the board, and board thermal resistance.

7.2 Thermal characteristics

Thermal attributes

S32K1xx Data Sheet, Rev. 14, 08/2021

NXP Semiconductors

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