5

DRV5023

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SLIS151G – MAY 2014 – REVISED SEPTEMBER 2016

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Copyright © 2014–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Ensured by design. Only tested to –20 V.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Power supply voltage

VCC

–22(2)

40

V

Voltage ramp rate (VCC), VCC < 5 V

Unlimited

V/µs

Voltage ramp rate (VCC), VCC > 5 V

0

2

Output pin voltage

–0.5

40

V

Output pin reverse current during reverse supply condition

0

100

mA

Magnetic flux density, BMAX

Unlimited

Operating junction temperature, TJ

–40

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic

discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)

±2500

V

Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2)

±500

(1)

Power dissipation and thermal limits must be observed.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VCC

Power supply voltage

2.5

38

V

VO

Output pin voltage (OUT)

0

38

V

ISINK

Output pin current sink (OUT)(1)

0

30

mA

TA

Operating ambient temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1)

DRV5023

UNIT

DBZ (SOT-23)

LPG (TO-92)

3 PINS

3 PINS

RθJA

Junction-to-ambient thermal resistance

333.2

180

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

99.9

98.6

°C/W

RθJB

Junction-to-board thermal resistance

66.9

154.9

°C/W

ψJT

Junction-to-top characterization parameter

4.9

40

°C/W

ψJB

Junction-to-board characterization parameter

65.2

154.9

°C/W