3

Module overview

The module is an SiP-LGA76 package (system in package land grid array) that integrates the proven

STM32WBA55UG MCU with several external components. The package includes:

•

LSE crystal

•

HSE crystal

•

passive components for SMPS

•

antenna matching and antenna

•

IPD for RF matching and harmonics rejection

Figure 1. STM32WBA5MMG block diagram

SMPS passive

components

Power supply

filtering

Antenna

matching

IPD

STM32WBA55UG

1 Mbyte flash

2x64 Kbyte RAM

XTAL

32.768 kHz

XTAL

32 MHz

Communication

Interfaces

External antenna

(optional)

3.1

Power supply

The power supply requirements are identical to those of the STM32WBA55UG devices, detailed in the datasheet

DS14127. Filtering capacitors on power supply pins and components for the SMPS are already integrated into the

module.

3.2

Clocks

As the crystals are already integrated into the package, it is impossible to use any clock in bypass mode. The

module integrates a 32.768 kHz crystal for LSE and a 32 MHz crystal for the HSE clock.

•

To tune the HSE clock, the software must read trim data from OTP address 0x0BF9 000E and copy it to

the RCC_ECSCR1.HSETRIM register.

•

The user must not change the RCC_ECSCR1 register configuration to keep the default parameters.

•

LSCO and MCO outputs are available.

STM32WBA5MMG

Module overview

DS14801 - Rev 3

page 5/25