7

Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,

depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product

status are available at: www.st.com. ECOPACK is an ST trademark.

7.1

Device marking

Refer to technical note "Reference device marking schematics for STM32 microcontrollers and microprocessors"

(TN1433 ) available on www.st.com, for the location of pin 1 / ball A1 as well as the location and orientation of the

marking areas versus pin 1 / ball A1.

Parts marked as "ES", "E" or accompanied by an engineering sample notification letter, are not yet qualified and

therefore not approved for use in production. ST is not responsible for any consequences resulting from such use.

In no event will ST be liable for the customer using any of these engineering samples in production. ST’s Quality

department must be contacted prior to any decision to use these engineering samples to run a qualification

activity.

A WLCSP simplified marking example (if any) is provided in the corresponding package information subsection.

7.2

SiP-LGA76 package information (B0N2)

This SiP-LGA is a 76-lead, 8 x 12.5 mm, system in package land grid array package.

Figure 5. SiP-LGA76 - Outline

B

A

aaa (4x)

eE

PIN1 CORNER

0.525

(x4) 0.35X0.35

BOTTOM VIEW

400µm Ref.

DETAIL A

,

600µm Ref.

E1

E

(x4) 0.60X0.60

(x68) 0.35X0.30

bbb C

SIDE VIEW

A

A1

Side Wall Sputter : 1~3µm

M

S

A

,

Top surface Sputter: 3~6µm

PIN A1 CORNER

8.000 ref.

TOP VIEW

0.625

57

58

56

55

54

53

59

60

61

50

62

52

51

49

48

47

46

45

44

43

42

41

40

39

63

64 65 66

67

38

37

36

35 34 33 32 31 30 29

26 25 24

23 22

28 27

1

2

3

4

8

5

6

9

10

11

12

13

14

15

16

17

18

19

20

21

7

68 69 70 71 72

73

76

75

74

1900

3.050

7.050

1. Drawing is not to scale.

STM32WBA5MMG

Package information

DS14801 - Rev 3

page 12/25