Contents

1

Introduction .......................................................................3

2

Description ........................................................................4

3

Module overview ..................................................................5

3.1

Power supply .................................................................. 5

3.2

Clocks........................................................................ 5

3.3

Antenna ...................................................................... 6

3.4

OTP.......................................................................... 6

4

Available peripherals ..............................................................7

5

Pin descriptions ...................................................................8

6

Electrical characteristics..........................................................11

6.1

Operating conditions........................................................... 11

6.2

Power consumption ........................................................... 11

6.3

RF characteristics ............................................................. 11

6.4

Schematics and layout for PCB.................................................. 11

6.5

Antenna radiation patterns and efficiency ......................................... 11

7

Package information..............................................................12

7.1

Device marking ............................................................... 12

7.2

SiP-LGA76 package information (B0N2) .......................................... 12

7.3

Thermal characteristics ........................................................ 14

7.3.1

Board design........................................................... 14

8

Ordering information .............................................................15

9

Certification ......................................................................16

9.1

Bluetooth® LE (RF_PHY) certification ............................................ 16

9.2

CE certification ............................................................... 16

9.3

FCC certification .............................................................. 16

9.4

ISED certification.............................................................. 17

9.5

MIC certification............................................................... 18

10

Product disposal .................................................................19

Important security notice ..............................................................20

Revision history .......................................................................21

List of tables ..........................................................................23

List of figures..........................................................................24

STM32WBA5MMG

Contents

DS14801 - Rev 3

page 22/25