XM33C321ASPZR datasheet(4/113 Pages) TI2

4 / 113 page

Table of Contents

1 Features............................................................................1

2 Applications..................................................................... 2

3 Description.......................................................................2

4 Functional Block Diagram.............................................. 3

5 Device Comparison......................................................... 5

6 Pin Configuration and Functions...................................6

6.1 Pin Diagrams.............................................................. 6

6.2 Pin Attributes.............................................................10

6.3 Signal Descriptions................................................... 25

6.4 Connections for Unused Pins................................... 37

7 Specifications................................................................ 38

7.1 Absolute Maximum Ratings...................................... 38

7.2 ESD Ratings............................................................. 38

7.3 Recommended Operating Conditions.......................38

7.4 Thermal Information..................................................39

7.5 Supply Current Characteristics................................. 39

7.6 Flash Memory Characteristics.................................. 41

7.7 Power Supply Sequencing........................................41

7.8 Clock Specifications..................................................44

7.9 Analog Specifications................................................46

7.10 Serial Interface Specifications.................................50

7.11 Digital IO................................................................. 56

7.12 TRNG......................................................................57

7.13 Emulation and Debug............................................. 57

8 Detailed Description......................................................58

8.1 Arm Cortex-M33 core with TrustZone and FPU........58

8.2 Power Management and Clock Unit (PMCU)........... 58

8.3 Device Memory Map................................................. 62

8.4 NVIC Interrupt Map .................................................. 65

8.5 Embedded Flash Memory.........................................66

8.6 Embedded SRAM..................................................... 66

8.7 DMA.......................................................................... 67

8.8 Event Manager..........................................................68

8.9 Error Aggregator Module (EAM)............................... 69

8.10 GPIO....................................................................... 69

8.11 IOMUX.................................................................... 70

8.12 Analog Modules...................................................... 71

8.13 Security and Cryptography..................................... 76

8.14 Serial Communication Interfaces............................ 78

8.15 LFSS....................................................................... 81

8.16 Timers, RTC and Watchdogs.................................. 81

8.17 Serial Wire Debug Interface....................................85

8.18 Bootstrap Loader (BSL).......................................... 85

8.19 Device Factory Constants ......................................85

8.20 Identification............................................................86

9 Applications, Implementation, and Layout................. 87

9.1 Typical Application.................................................... 87

10 Device and Documentation Support..........................88

10.1 Getting Started and Next Steps.............................. 88

10.2 Device Nomenclature..............................................88

10.3 Tools and Software................................................. 89

10.4 Documentation Support.......................................... 90

10.5 Support Resources................................................. 90

10.6 Trademarks.............................................................90

10.7 Electrostatic Discharge Caution..............................90

10.8 Glossary..................................................................90

11 Revision History.......................................................... 91

12 Mechanical, Packaging, and Orderable

Information.................................................................... 92

MSPM33C321A, MSPM33C3219

SLASFB6 – DECEMBER 2025

www.ti.com

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