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AM2431BSDGHIALVR. Datasheet(PDF) 138 Page - Texas Instruments

Part # AM2431BSDGHIALVR.
Description  AM243x Sitara™ Microcontrollers
PDF  282 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
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AM2431BSDGHIALVR. Datasheet(HTML) 138 Page - Texas Instruments

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AM65x_MCU_OSC_CC_05
C
PCBXI
C
PCBXO
C
L1
C
L2
PCB
Signal Traces
Crystal Circuit
Components
MCU_OSC0_XO
MCU_OSC0_XI
C
XI
C
XO
Device
Figure 6-19. Load Capacitance
Load capacitors, CL1 and CL2 in Figure 6-17, should be chosen such that the below equation is satisfied. CL in
the equation is the load specified by the crystal manufacturer.
CL = [(CL1 + CPCBXI + CXI) × (CL2 + CPCBXO + CXO)] / [(CL1 + CPCBXI + CXI) + (CL2 + CPCBXO + CXO)]
To determine the value of CL1 and CL2, multiply the capacitive load value CL by 2. Using this result, subtract
the combined values of CPCBXI + CXI to determine the value of CL1 and the combined values of CPCBXO + CXO
to determine the value of CL2. For example, if CL = 10pF, CPCBXI = 2.9pF, CXI = 0.5pF, CPCBXO = 3.7pF, CXO =
0.5pF, the value of CL1 = [(2CL) - (CPCBXI + CXI)] = [(2 × 10pF) - 2.9pF - 0.5pF)] = 16.6pF and CL2 = [(2CL) -
(CPCBXO + CXO)] = [(2 × 10pF) - 3.7pF - 0.5pF)] = 15.8pF
6.11.4.1.1.2 Shunt Capacitance
The crystal circuit must also be designed such that it does not exceed the maximum shunt capacitance for
MCU_OSC0 operating conditions defined in Table 6-22. Shunt capacitance, Cshunt, of the crystal circuit is a
combination of crystal shunt capacitance and parasitic contributions. PCB signal traces which connect crystal
circuit components to MCU_OSC0 have mutual parasitic capacitance to each other, CPCBXIXO, where the PCB
designer should be able to extract mutual parasitic capacitance between these signal traces. The device
package also has mutual parasitic capacitance, CXIXO, where this mutual parasitic capacitance value is defined
in Table 6-23.
PCB routing should be designed to minimize mutual capacitance between XI and XO signal traces. This is
typically done by keeping signal traces short and not routing them in close proximity. Mutual capacitance can
also be minimized by placing a ground trace between these signals when the layout requires them to be routed
in close proximity. It is important to minimize the mutual capacitance on the PCB to provide as much margin as
possible when selecting a crystal.
AM2434, AM2432, AM2431
SPRSP65J – APRIL 2021 – REVISED JUNE 2026
www.ti.com
138
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Copyright © 2026 Texas Instruments Incorporated
Product Folder Links: AM2434 AM2432 AM2431



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