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AM2431BSDGHIALVR. Datasheet(PDF) 137 Page - Texas Instruments

Part # AM2431BSDGHIALVR.
Description  AM243x Sitara™ Microcontrollers
PDF  282 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

AM2431BSDGHIALVR. Datasheet(HTML) 137 Page - Texas Instruments

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When selecting a crystal, the system design must consider temperature and aging characteristics of the crystal
based on worst case environment and expected life expectancy of the system.
Table 6-23 details the switching characteristics of the oscillator.
Table 6-23. MCU_OSC0 Switching Characteristics - Crystal Mode
PARAMETER
PACKAGE
MIN
TYP
MAX
UNIT
CXI
XI Capacitance
ALV
1.44
pF
CXO
XO Capacitance
1.52
pF
CXIXO
XI to XO Mutual Capacitance
0.01
pF
CXI
XI Capacitance
ANI
1.435
pF
CXO
XO Capacitance
1.472
pF
CXIXO
XI to XO Mutual Capacitance
0.01
pF
CXI
XI Capacitance
ALX
0.812
pF
CXO
XO Capacitance
0.821
pF
CXIXO
XI to XO Mutual Capacitance
0.01
pF
ts
Start-up Time
4
ms
VDDS_OSC
MCU_OSC0_XO
t
sX
Time
VSS
VDDS_OSC (min.)
VDD_CORE (min.)
VSS
VDD_CORE
AM65x_MCU_OSC_STARTUP_02
Figure 6-18. MCU_OSC0 Start-up Time
6.11.4.1.1.1 Load Capacitance
The crystal circuit must be designed such that it applies the appropriate capacitive load to the crystal, as defined
by the crystal manufacturer. The capacitive load, CL, of this circuit is a combination of discrete capacitors
CL1, CL2, and several parasitic contributions. PCB signal traces which connect crystal circuit components to
MCU_OSC0_XI and MCU_OSC0_XO have parasitic capacitance to ground, CPCBXI and CPCBXO, where the
PCB designer should be able to extract parasitic capacitance for each signal trace. The MCU_OSC0 circuits
and device package have combined parasitic capacitance to ground, CPCBXI and CPCBXO, where these parasitic
capacitance values are defined in Table 6-23.
www.ti.com
AM2434, AM2432, AM2431
SPRSP65J – APRIL 2021 – REVISED JUNE 2026
Copyright © 2026 Texas Instruments Incorporated
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Product Folder Links: AM2434 AM2432 AM2431



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