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TMP9R01DGS/EM Datasheet(PDF) 14 Page - Texas Instruments

Part # TMP9R01DGS/EM
Description  TMP9R01-SP (QMLP RHA) and TMP9R01-SEP (Radiation Tolerant) Space-Grade, I²C Digital Temperature Sensor With Remote and Local (On-Chip) Temperature Sensing
PDF  45 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

TMP9R01DGS/EM Datasheet(HTML) 14 Page - Texas Instruments

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7 Detailed Description
7.1 Overview
The TMP9R01-SEP and TMP9R01-SP device is a digital temperature sensor that combines a local temperature
measurement channel and a remote-junction temperature measurement channel in a single VSSOP DGS-10
package. The device is two-wire- and SMBus-interface-compatible with nine pin-programmable bus address
options, and is specified over a temperature range of –55°C to 125°C. The TMP9R01-SEP and TMP9R01-SP
device also contains multiple registers for programming and holding configuration settings, temperature limits,
and temperature measurement results.
The TMP9R01-SEP and TMP9R01-SP requires only a transistor connected between D+ and D– for proper
remote temperature sensing operation. The SCL and SDA interface pins require pullup resistors as part of the
communication bus, while ALERT and THERM pins are open-drain outputs that require pullup resistors. ALERT
and THERM pins can be shared with other devices for a wired-OR implementation, if desired. TI recommends
using a 0.1µF power-supply bypass capacitor for good local bypassing. Figure 7-1 shows a typical configuration
for the TMP9R01-SEP and TMP9R01-SP.
GND
SDA
SCL
A1
D–
D+
ALERT/ THERM2
A0
V+
THERM
TMP9R01-SEP
6
7
8
9
10
1
2
3
4
5
SMBus
Controller
Host Processor
GND
TL1431-SP
or
LM4050QML-SP
TL1431-SP
or
LM4050QML-SP
Vbatt
Vbatt
GND
Overtemperature
Shutdown
1.7V to 3.6V
1.7V to 3.6V
GND
Built-in
Thermal
Transistor
or Diode
FPGA, ADC,
DAC, or ASIC
CDIFF
RS
RS
PNP Diode-connected configuration
(A):
CDIFF
RS
NPN Diode-connected configuration
(A):
Transistor-connected configuration
(A):
RS
CDIFF
RS
RS
(B)
(B)
(B)
(B)
(B)
(B)
(C)
(C)
(C)
Figure 7-1. Basic Connections
A.
Diode-connected configuration provides better settling time. Transistor-connected configuration provides better series resistance
cancellation. NPN transistors must be diode-connected. PNP transistors can either be transistor or diode-connected. For more
information on NPN/PNP transistors see Remote Temperature Sensor Transistor Selection Guide application note.
B.
Rs (optional) must be < 1kΩ in most applications. Selections of Rs depends on specific applications; see the Section 7.3.5
C.
CDIFF (optional) must be < 1000pF in most applications. Selection of CDIFF depends on specific application; see the Section 7.3.5 and
Figure 6-8.
TMP9R01-SEP, TMP9R01-SP
SNIS238A – JULY 2025 – REVISED JULY 2026
www.ti.com
14
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Copyright © 2026 Texas Instruments Incorporated
Product Folder Links: TMP9R01-SEP TMP9R01-SP



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