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TMP9R01DGS/EM Datasheet(PDF) 1 Page - Texas Instruments |
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TMP9R01DGS/EM Datasheet(HTML) 1 Page - Texas Instruments |
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1 / 45 page ![]() TMP9R01-SP (QMLP RHA) and TMP9R01-SEP (Radiation Tolerant) Space-Grade, I2C Digital Temperature Sensor With Remote and Local (On-Chip) Temperature Sensing 1 Features • QMLP, Radiation Hardness Assured (RHA) – SMD 5962-17218: – TID characterized up to 100krad(Si) – TID RLAT/RHA to 100krad(Si) – SEL immune to LET= 75MeV×cm2/mg at 125°C – SEE characterized to LET= 75MeV×cm2/mg – SEFI characterized to LET= 75MeV×cm2/mg – QMLV version available: TMP461-SP • Radiation Tolerant (Space Enhanced Plastic) – Vendor item drawing (VID) V62/24615 – TID characterized up to 50krad(Si) – TID RLAT/RHA to 30krad(Si) – SEL immune to LET= 43MeV×cm2/mg at 125°C – SEE characterized to LET= 43MeV×cm2/mg – SEFI characterized to LET= 43MeV×cm2/mg • Temperature accuracy and range: – 12-bit resolution: 0.0625°C (LSB) – Local (on-chip) temp accuracy: ±2.0°C (Max) – Remote junction temp accuracy: ±1.5°C (Max) – Remote range tested to: –64°C to 191°C – Military temperature range: -55 to 125°C • Small-size package: VSSOP-10, 4.9mm × 3.0mm • Integrated calibration/ protection features: – η-factor and offset correction – Series resistance cancellation – Remote BJT/diode fault detection – Programmable digital filter • Wide operating range, low power: – Voltage supply range: 1.7V to 3.6V – I/O voltages: 1.8V, 2.5V, and 3.3V – Standby/shutdown IQ: 15μA/3μA 2 Applications • Space-grade FPGA, ADCs, DACs, and ASIC integrated junction temperature sensing • Communications payload • Radar imaging payload • Optical imaging payload • On-board computer (OBC) • Command & data handling (C&DH) 3 Description The TMP9R01-SP (QML Class P) and TMP9R01- SEP (Radiation Tolerant, Space EP) are high- accuracy digital I2C temperature sensors integrating a 12-bit ADC, bias current sources, and calibration circuitry in a 10-pin VSSOP plastic package. The devices measure remote temperature by forcing a bias current through an external BJT or the integrated diode/junction of an FPGA, ADC, or ASIC, digitizing the resulting ΔVBE and reporting temperature with 0.0625°C resolution. An additional on-chip sensor provides local temperature measurement. The TMP9R01-SP and TMP9R01-SEP incorporate multiple calibration and protection features, including series-resistance cancellation, programmable non- ideality factor (η-Factor), offset correction, and programmable digital filter. Designers can set high- and low-temperature limits that drive the ALERT output for over-and-under temperature thermal protection. Up to 9 pin-selectable I2C/SMBus addresses allow multiple sensors on the same I2C bus. The devices are designed for multi-location spacecraft housekeeping, satellite telemetry, avionics, and other high-reliability applications that require precise, temperature sensing and with varying levels of radiation hardness. The TMP9R01-SP is also available as a functionally equivalent QMLV-RHA device: TMP461-SP. Table 3-1. Package Information DEVICE Grade PACKAGE(2) 5962R1721802PYE QMLP RHA 24-pin plastic 4.9mm × 3.0mm Mass = 99mg TMP9R01DGS/EM(1) Engineering Sample TMP9R01MDGSTSEP Rad Tolerant (1) Units intended only for engineering evaluation (2) The mass is a nominal value and the body size (length × width) is a nominal value and include pins. OSC SCL V+ GND TMP9R01 ADC Digital Core THERM On-Chip (Local) BJT Register Bank I2C Interface SDA A1 BJT Bias Currents D+ D- FPGA/ASIC/ADC/DAC with Integrated Thermal Junction -- or – Discrete BJT A0 ALERT/ THERM2 °C °C N1×I N2×I I Functional Block Diagram TMP9R01-SEP, TMP9R01-SP SNIS238A – JULY 2025 – REVISED JULY 2026 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. |
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