TMP9R01DGSSLASHEM datasheet(31/45 Pages) TI2

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9 Application and Implementation

Note

Information in the following applications sections is not part of the TI component specification,

and TI does not warrant its accuracy or completeness. TI’s customers are responsible for

determining suitability of components for their purposes, as well as validating and testing their design

implementation to confirm system functionality.

9.1 Application Information

The TMP9R01-SEP and TMP9R01-SP devices requires only a transistor connected between the D+ and D–

pins for remote temperature measurement. Tie the D+ pin to D– or GND if the remote channel is not used

and only the local temperature is measured. The SDA, ALERT, and THERM pins (and SCL, if driven by an

open-drain output) require pullup resistors as part of the communication bus. A 0.1µF power-supply decoupling

capacitor is recommended for local bypassing. TMP9R01-SEP and TMP9R01-SP Basic Connections Using a

Processor Built-In Remote Transistor shows the typical configurations for the device.

For additional information, refer to the application note: How to Optimize Space-Grade Temperature Sensing

Designs.

9.2 Typical Application

GND

SDA

SCL

D–

D+

ALERT/ THERM2

V+

THERM

TMP9R01-SEP

TMP9R01-SP

SMBus

Controller

Host Processor

GND

TL1431-SP

LM4050QML-SP

TL1431-SP

LM4050QML-SP

Vbatt

GND

Overtemperature

Shutdown

1.7V to 3.6V

GND

Built-in

Thermal

Transistor

or Diode

FPGA, ADC,

DAC, or ASIC

Figure 9-1. TMP9R01-SEP and TMP9R01-SP Basic Connections Using a Processor Built-In Remote

Transistor

9.2.1 Design Requirements

The TMP9R01-SEP and TMP9R01-SP devices are designed to be used with either discrete transistors or

substrate transistors built into processor chips and application-specific integrated circuits (ASICs). Either NPN

or PNP transistors can be used, as long as the base-emitter junction is used as the remote temperature sense.

www.ti.com

TMP9R01-SEP, TMP9R01-SP

SNIS238A – JULY 2025 – REVISED JULY 2026

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