10 Device and Documentation Support

10.1 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on

Notifications to register and receive a weekly digest of any product information that has changed. For change

details, review the revision history included in any revised document.

10.2 Related Documentation

For related documentation see the following:

• Texas Instruments, TMP461-SP Radiation-Hardness-Assured (RHA), High-Accuracy Remote and Local

Temperature Sensor, datasheet

• Texas Instruments, TMP9R01-SP Single-Event Effects (SEE) Radiation Test Report, radiation report

• Texas Instruments, TMP9R01-SEP Single-Event Effects (SEE) Radiation Test Report, radiation report

• Texas Instruments, TMP9R01-SEP Total Ionizing Dose (TID) Report, radiation report

• Texas Instruments, TMP9R01 Evaluation Module, EVM User's Guide

• Texas Instruments, Remote Temperature Sensor Transistor Selection Guide, application note

• Texas Instruments, How to Optimize Space-Grade Temperature Sensing Designs, application note

• Texas Instruments, TI Space Qualified Temperature Sensor Product Selection Guide

10.3 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

10.4 Trademarks

TI E2E™ is a trademark of Texas Instruments.

All trademarks are the property of their respective owners.

10.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

10.6 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

11 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from July 25, 2025 to July 8, 2026 (from Revision * (July 2025) to Revision A (May

2026))

Page

• Updated the document to included the released TMP9R01-SP device............................................................. 1

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

www.ti.com

TMP9R01-SEP, TMP9R01-SP

SNIS238A – JULY 2025 – REVISED JULY 2026

Copyright © 2026 Texas Instruments Incorporated

Submit Document Feedback

37

Product Folder Links: TMP9R01-SEP TMP9R01-SP