R5F213G4DNSP datasheet(6/45 Pages) RENESAS

6 / 45 page

R8C/3GD Group

1. Overview

REJ03B0289-0100 Rev.1.00

Feb 26, 2010

Page 4 of 41

1.2

Product List

Table 1.3 lists Product List for R8C/3GD Group, and Figure 1.1 shows a Part Number, Memory Size, and Package

of R8C/3GD Group.

(D): Under development

Figure 1.1

Part Number, Memory Size, and Package of R8C/3GD Group

Table 1.3

Product List for R8C/3GD Group

Current of Feb. 2010

Part No.

ROM Capacity

RAM Capacity

Package Type

Remarks

R5F213G1DNSP

4 Kbytes

1 Kbyte

PLSP0024JB-A

N version

R5F213G2DNSP

8 Kbytes

1 Kbyte

PLSP0024JB-A

R5F213G4DNSP

16 Kbytes

1 Kbyte

PLSP0024JB-A

R5F213G5DNSP

24 Kbytes

1 Kbyte

PLSP0024JB-A

R5F213G6DNSP

32 Kbytes

1 Kbyte

PLSP0024JB-A

R5F213G1DDSP (D)

4 Kbytes

1 Kbyte

PLSP0024JB-A

D version

R5F213G2DDSP (D)

8 Kbytes

1 Kbyte

PLSP0024JB-A

R5F213G4DDSP (D)

16 Kbytes

1 Kbyte

PLSP0024JB-A

R5F213G5DDSP (D)

24 Kbytes

1 Kbyte

PLSP0024JB-A

R5F213G6DDSP (D)

32 Kbytes

1 Kbyte

PLSP0024JB-A

Part No.

R 5 F 21 3G 6 D N SP

Package type:

SP: PLSP0024JB-A (0.65 mm pin-pitch)

Classification

N: Operating ambient temperature -20°C to 85°C

D: Operating ambient temperature -40°C to 85°C

ROM capacity

1: 4KB

2: 8KB

4: 16KB

5: 24KB

6: 32KB

R8C/3GD Group

R8C/3x Series

Memory type

F: Flash memory

Renesas MCU

Renesas semiconductor

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