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R5F213G4DNSP Datasheet(PDF) 3 Page - Renesas Technology Corp |
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R5F213G4DNSP Datasheet(HTML) 3 Page - Renesas Technology Corp |
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3 / 45 page ![]() REJ03B0289-0100 Rev.1.00 Feb 26, 2010 Page 1 of 41 R8C/3GD Group RENESAS MCU 1. Overview 1.1 Features The R8C/3GD Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1 Mbyte of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing. Power consumption is low, and the supported operating modes allow additional power control. These MCUs are designed to maximize EMI/EMS performance. Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of system components. 1.1.1 Applications Electronic household appliances, office equipment, audio equipment, consumer equipment, etc. REJ03B0289-0100 Rev.1.00 Feb 26, 2010 |
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