PCF8576 datasheet(34/44 Pages) PHILIPS

34 / 44 page

2001 Oct 02

Philips Semiconductors

Product speciﬁcation

Universal LCD driver for low multiplex rates

PCF8576

12.1

Chip-on-glass cascadability in single plane

In chip-on-glass technology, where driver devices are

bonded directly onto glass of the LCD, it is important that

the devices may be cascaded without the crossing of

conductors, but the paths of conductors can be continued

on the glass under the chip. All of this is facilitated by the

PCF8576 bonding pad layout (see Fig.30). Pads needing

bus interconnection between all PCF8576s of the cascade

are VDD, VSS, VLCD, CLK, SCL, SDA and SYNC. These

lines may be led to the corresponding pads of the next

PCF8576 through the wide opening between VLCD pad

and the backplane output pads. The only bus line that does

not require a second opening to lead through to the next

PCF8576 is VLCD, being the cascade centre. The placing

of VLCD adjacent to VSS allows the two supplies to be

connected together.

When an external clocking source is to be used, OSC of all

devices should be connected to VDD. The pads OSC,

A0, A1, A2 and SA0 have been placed between

VSS and VDD to facilitate wiring of oscillator, hardware

subaddress and slave address.

13 BONDING PAD INFORMATION

Fig.30 Bonding pad locations.

Bonding pad dimensions: 120

× 120 µm.

Gold bump dimensions: 94

× 94 × 25 µm.

handbook, full pagewidth

MBK282

BP3

BP1

BP2

BP0

VLCD

VSS

SA0

S33

S32

S31

S30

S29

S28

S27

S26

S25

S24

S23

S22

S21

S20

S19

S18

PCF8576

cascade

centre

3.07 mm

4.12

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