SPC56EC64L8 datasheet(53/118 Pages) STMICROELECTRONICS

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SPC564Bxx - SPC56ECxx

Electrical Characteristics

Doc ID 17478 Rev 4

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Note:

SRAM retention guaranteed to LVD levels.

4.5

Thermal characteristics

4.5.1

Package thermal characteristics

IINJPAD

Injected input current on any pin

during overload condition

—–5

IINJSUM

Absolute sum of all injected input

currents during overload condition

—

–50

TVDD

VDD_HV_A slope to ensure correct

power up(8)

——

0.5

V/µs

—

0.5

—

V/min

TA C-Grade Part SR Ambient temperature under bias

—

−40

°C

TJ C-Grade Part SR Junction temperature under bias

—

−40

110

TA V-Grade Part SR Ambient temperature under bias

—

−40

105

TJ V-Grade Part SR Junction temperature under bias

—

−40

130

TA M-Grade Part SR Ambient temperature under bias

—

−40

125

TJ M-Grade Part SR Junction temperature under bias

—

−40

150

100 nF EMI capacitance and 10 µF bulk capacitance needs to be provided between each VDD_HV_A/HV_B/VSS_HV pair.

Full device operation is guaranteed by design from 3.0 V–5.5 V. OSC electrical characteristics (startup time, IDD, negative

resistance, ESR and duty cycle) will not be guaranteed to stay within the stated limits when operating below 4.5 V and

above 3.6 V. However, OSC functionality is guaranteed within the entire range (3.0 V–5.5 V).

100 nF EMI capacitance and 40 µF bulk capacitance needs to be provided between each VDD_LV/VSS_LV supply pair.

This voltage is internally generated by the device and no external voltage should be supplied.

100 nF capacitance needs to be provided between VDD_HV_(ADC0/ADC1)/VSS_HV_(ADC0/ADC1) pair.

Both the relative and the fixed conditions must be met. For instance: If VDD_HV_A is 5.9 V, VDD_HV_ADC0 maximum value is

6.0 V then, despite the relative condition, the max value is VDD_HV_A + 0.3 = 6.2 V.

PA3, PA7, PA10, PA11 and PE12 ADC_1 channels are coming from VDD_HV_B domain hence VDD_HV_ADC1 should be

within ±100 mV of VDD_HV_B when these channels are used for ADC_1.

Guaranteed by device validation.

Table 11.

Recommended operating conditions (5.0 V) (continued)

Symbol

Parameter

Conditions

Value

Unit

Min

Max

Table 12.

LQFP thermal characteristics(1)

Symbol

Parameter

Conditions(2)

count

Value(3)

Unit

Min

Typ

Max

RθJA

Thermal resistance,

junction-to-ambient

natural convection

Single-layer

board—1s

176

—

44.4(4)

°C/W

208

—

TBD

°C/W

RθJA

Thermal resistance,

junction-to-ambient

natural convection

Four-layer

board—2s2p(5)

176

—

36.1

°C/W

208

—

TBD

°C/W

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