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SPC56EC64L8 Datasheet(PDF) 68 Page - STMicroelectronics

Part # SPC56EC64L8
Description  32-bit MCU family built on the Power Architecture® for automotive body electronics applications
PDF  118 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

SPC56EC64L8 Datasheet(HTML) 68 Page - STMicroelectronics

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Electrical Characteristics
SPC564Bxx - SPC56ECxx
68/118
Doc ID 17478 Rev 4
Table 25.
Low voltage power domain electrical characteristics
Symbol
C
Parameter
Conditions(1)
Value
Unit
Min
Typ(2)
Max(3)
IDDMAX
(4)
CC D
RUN mode maximum
average current
210
300(5),(6) mA
IDDRUN
CC
T RUN mode typical average
current(7)
at 120 MHz
TA =25 °C
175(8),
(9)
240(9),
(10)
mA
Tat 80 MHz
TA = 25 °C
110(8)
150(10)
mA
IDDHALT
CC P HALT mode current(11)
25
35
mA
IDDSTOP
CC
P
STOP mode current(12)
No clocks active
TA = 25 °C
400(9)
1200(9),
(13)
µA
PTA = 150 °C
10(9)
30(9)
mA
IDDSTDBY3
(96 KB RAM
retained)
CC
P
STANDBY3 mode
current(14)
No clocks active
TA = 25 °C
60
175
µA
PTA = 150 °C
1000
3000
µA
IDDSTDBY2
(64 KB RAM
retained)
CC
P
STANDBY2 mode
current(15)
No clocks active
TA = 25 °C
45
135
µA
PTA = 150 °C
800
2000
µA
IDDSTDBY1
(8 KB RAM
retained)
CC
T
STANDBY1 mode
current(16)
No clocks active
TA = 25 °C
25
75
µA
PTA = 150 °C
500
1000
µA
Adders in
LP mode
CC T
32 kHz OSC
TA =25 °C
5
µA
4–40 MHz OSC
TA =25 °C
3
mA
16 MHz IRC
TA = 25 °C
500
µA
128 kHz IRC
TA =25 °C
5
µA
1.
VDD = 3.3 V ± 10% / 5.0 V ± 10%, TA = −40 to 125 °C, unless otherwise specified All temperatures are based on an
ambient temperature.
2.
Target typical current consumption for the following typical operating conditions and configuration. Process = typical,
Voltage = 1.2 V.
3.
Target maximum current consumption for mode observed under typical operating conditions. Process = Fast, Voltage =
1.32 V.
4.
Running consumption is given on voltage regulator supply (VDDREG). It does not include consumption linked to I/Os
toggling. This value is highly dependent on the application. The given value is thought to be a worst case value with all
cores and peripherals running, and code fetched from code flash while modify operation on-going on data flash. It is to be
noticed that this value can be significantly reduced by application: switch-off not used peripherals (default), reduce
peripheral frequency through internal prescaler, fetch from RAM most used functions, use low power mode when possible.
5.
Higher current may sunk by device during power-up and standby exit. Please refer to in rush current in Table 23.
6.
Maximum “allowed” current is package dependent.
7.
Only for the “P” classification: Code fetched from RAM: Serial IPs CAN and LIN in loop back mode, DSPI as Master, PLL
as system Clock (4 x Multiplier) peripherals on (eMIOS/CTU/ADC) and running at max frequency, periodic SW/WDG timer
reset enabled. RUN current measured with typical application with accesses on both code flash and RAM.
8.
Subject to change, Configuration: 1
× e200z4d + 4 kbit/s Cache, 1 × eDMA (32 ch), 4 × FlexCAN (2 × 500 kbit/s, 2 ×
125 kbit/s), 10
× LINFlexD (20 kbit/s), 8 × DSPI (4 × 2 Mbit/s, 3 × 4 Mbit/s, 1 × 10 Mbit/s), 40 × PWM (200 Hz), 40 × ADC
Input, 1
× CTU (40 ch.), 1 × FlexRay (2 ch., 10 Mbit/s), 1 × RTC, 4 × PIT, 1 × SWT, 1 × STM. Ethernet and e200z0h
disabled. Also reduced timed I/O channels for smaller packages. RUN current measured with typical application with
accesses on both code flash and RAM.
9.
This value is obtained from limited sample set



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