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SPC56EC64L8 Datasheet(PDF) 68 Page - STMicroelectronics |
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SPC56EC64L8 Datasheet(HTML) 68 Page - STMicroelectronics |
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68 / 118 page ![]() Electrical Characteristics SPC564Bxx - SPC56ECxx 68/118 Doc ID 17478 Rev 4 Table 25. Low voltage power domain electrical characteristics Symbol C Parameter Conditions(1) Value Unit Min Typ(2) Max(3) IDDMAX (4) CC D RUN mode maximum average current — — 210 300(5),(6) mA IDDRUN CC T RUN mode typical average current(7) at 120 MHz TA =25 °C — 175(8), (9) 240(9), (10) mA Tat 80 MHz TA = 25 °C 110(8) 150(10) mA IDDHALT CC P HALT mode current(11) — — 25 35 mA IDDSTOP CC P STOP mode current(12) No clocks active TA = 25 °C — 400(9) 1200(9), (13) µA PTA = 150 °C — 10(9) 30(9) mA IDDSTDBY3 (96 KB RAM retained) CC P STANDBY3 mode current(14) No clocks active TA = 25 °C — 60 175 µA PTA = 150 °C — 1000 3000 µA IDDSTDBY2 (64 KB RAM retained) CC P STANDBY2 mode current(15) No clocks active TA = 25 °C — 45 135 µA PTA = 150 °C — 800 2000 µA IDDSTDBY1 (8 KB RAM retained) CC T STANDBY1 mode current(16) No clocks active TA = 25 °C — 25 75 µA PTA = 150 °C — 500 1000 µA Adders in LP mode CC T 32 kHz OSC — TA =25 °C — — 5 µA 4–40 MHz OSC — TA =25 °C — — 3 mA 16 MHz IRC — TA = 25 °C — — 500 µA 128 kHz IRC — TA =25 °C — — 5 µA 1. VDD = 3.3 V ± 10% / 5.0 V ± 10%, TA = −40 to 125 °C, unless otherwise specified All temperatures are based on an ambient temperature. 2. Target typical current consumption for the following typical operating conditions and configuration. Process = typical, Voltage = 1.2 V. 3. Target maximum current consumption for mode observed under typical operating conditions. Process = Fast, Voltage = 1.32 V. 4. Running consumption is given on voltage regulator supply (VDDREG). It does not include consumption linked to I/Os toggling. This value is highly dependent on the application. The given value is thought to be a worst case value with all cores and peripherals running, and code fetched from code flash while modify operation on-going on data flash. It is to be noticed that this value can be significantly reduced by application: switch-off not used peripherals (default), reduce peripheral frequency through internal prescaler, fetch from RAM most used functions, use low power mode when possible. 5. Higher current may sunk by device during power-up and standby exit. Please refer to in rush current in Table 23. 6. Maximum “allowed” current is package dependent. 7. Only for the “P” classification: Code fetched from RAM: Serial IPs CAN and LIN in loop back mode, DSPI as Master, PLL as system Clock (4 x Multiplier) peripherals on (eMIOS/CTU/ADC) and running at max frequency, periodic SW/WDG timer reset enabled. RUN current measured with typical application with accesses on both code flash and RAM. 8. Subject to change, Configuration: 1 × e200z4d + 4 kbit/s Cache, 1 × eDMA (32 ch), 4 × FlexCAN (2 × 500 kbit/s, 2 × 125 kbit/s), 10 × LINFlexD (20 kbit/s), 8 × DSPI (4 × 2 Mbit/s, 3 × 4 Mbit/s, 1 × 10 Mbit/s), 40 × PWM (200 Hz), 40 × ADC Input, 1 × CTU (40 ch.), 1 × FlexRay (2 ch., 10 Mbit/s), 1 × RTC, 4 × PIT, 1 × SWT, 1 × STM. Ethernet and e200z0h disabled. Also reduced timed I/O channels for smaller packages. RUN current measured with typical application with accesses on both code flash and RAM. 9. This value is obtained from limited sample set |
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