PXR40 datasheet(53/100 Pages) FREESCALE

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Electrical characteristics

PXR40 Microcontroller Data Sheet, Rev. 1

Freescale Semiconductor

5.2

Thermal characteristics

1 Functional operating conditions are given in the DC electrical specifications. Absolute maximum ratings are stress ratings only,

and functional operation at the maxima is not guaranteed. Stress beyond the listed maxima may affect device reliability or

cause permanent damage to the device.

2 2.0 V for 10 hours cumulative time, 1.32 V +10% for time remaining.

3 6.4 V for 10 hours cumulative time, 5.25 V +10% for time remaining.

4 Voltage overshoots during a high-to-low or low-to-high transition must not exceed 10 seconds per instance.

5 5.3 V for 10 hours cumulative time, 3.60 V +10% for time remaining.

6 PXR40 has two analog power supply pins on the pinout: VDDA_A and VDDA_B.

7 PXR40 has two analog ground supply pins on the pinout: VSSA_A and VSSA_B.

8 PXR40 has two analog low reference voltage pins on the pinout: VRL_A and VRL_B.

9 PXR40 has two analog high reference voltage pins on the pinout: VRH_A and VRH_B.

10 Total injection current for all pins must not exceed 25 mA at maximum operating voltage.

11 Injection current of ±5 mA allowed for limited duration for analog (ADC) pads and digital 5 V pads. The maximum accumulated

time at this current shall be 60 hours. This includes an assumption of a 5.25 V maximum analog or VDDEH supply when under

this stress condition.

12 Total injection current for all analog input pins must not exceed 15 mA.

13 Lifetime operation at these specification limits is not guaranteed.

14 Solder profile per CDF-AEC-Q100.

15 Moisture sensitivity per JEDEC test method A112.

Table 4. Thermal characteristics, 416-pin TEPBGA package1

1 Thermal characteristics are targets based on simulation that are subject to change per device

characterization. This data is PRELIMINARY based on similar package used on other devices.

Characteristic

Symbol

Value

Unit

Junction to Ambient 2,3 Natural Convection (Single layer board)

2 Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting

site (board) temperature, ambient temperature, air flow, power dissipation of other components on the

board, and board thermal resistance.

3 Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification.

RJA

°C/W

Junction to Ambient 2,4 Natural Convection (Four layer board 2s2p)

4 Per JEDEC JESD51-6 with the board horizontal.

RJA

°C/W

Junction to Ambient (@200 ft./min., Single layer board)

RJMA

°C/W

Junction to Ambient (@200 ft./min., Four layer board 2s2p)

RJMA

°C/W

Junction to Board 5

5 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board

temperature is measured on the top surface of the board near the package.

RJB

9°C/W

Junction to Case 6

6 Indicates the average thermal resistance between the die and the case top surface as measured by the

cold plate method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case

temperature.

RJC

6°C/W

Junction to Package Top 7 Natural Convection

7 Thermal characterization parameter indicating the temperature difference between package top and the

junction temperature per JEDEC JESD51-2.



2°C/W

PXR40 Datasheet(PDF) 53 Page - Freescale Semiconductor, Inc

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