MPC8241EC datasheet(31/58 Pages) FREESCALE

Part #	MPC8241EC

Description	MPC8241 Integrated Processor Hardware Specifications

PDF	58 Pages

Scroll/Zoom	100%

Manufacturer	FREESCALE [Freescale Semiconductor, Inc]

Direct Link	http://www.freescale.com

Logo

31 / 58 page

MPC8241 Integrated Processor Hardware Specifications, Rev. 10

Freescale Semiconductor

Package Description

Figure 23. Test Access Port Timing Diagram

Package Description

This section details package parameters, pin assignments, and dimensions.

5.1

Package Parameters for the MPC8241

The MPC8241 uses a 25 mm

× 25 mm, cavity up, 357-pin plastic ball grid array (PBGA) package. The

package parameters are as follows.

Package outline

25 mm

× 25 mm

Interconnects

357

Pitch

1.27 mm

Solder balls

ZP (PBGA)—62 Sn/36 Pb/2 Ag—available only in Rev B parts

ZQ (Thick substrate thick mold cap PBGA)—62 Sn/36 Pb/2 Ag

VR (Lead free version of package)—95.5 Sn/4.0 Ag/0.5 Cu

Solder ball diameter

0.75 mm

Maximum module height

2.52 mm

Co-planarity specification

0.15 mm

Maximum force

6.0 lbs. total, uniformly distributed over package (8 grams/ball)

Input Data Valid

Output Data Valid

TCK

TDI, TMS

TDO

MPC8241EC Datasheet(PDF) 31 Page - Freescale Semiconductor, Inc