MPC8241EC datasheet(50/58 Pages) FREESCALE

Part #	MPC8241EC

Description	MPC8241 Integrated Processor Hardware Specifications

PDF	58 Pages

Scroll/Zoom	100%

Manufacturer	FREESCALE [Freescale Semiconductor, Inc]

Direct Link	http://www.freescale.com

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50 / 58 page

MPC8241 Integrated Processor Hardware Specifications, Rev. 10

Freescale Semiconductor

System Design Information

Figure 31. Thermal Performance of Select Thermal Interface Material

The board designer can choose among several types of thermal interface. Heat sink adhesive materials are

selected on the basis of high conductivity and adequate mechanical strength to meet equipment

shock/vibration requirements. Several commercially-available thermal interfaces and adhesive materials

are provided by the following vendors:

The Bergquist Company

800-347-4572

18930 West 78th St.

Chanhassen, MN 55317

Internet: www.bergquistcompany.com

Chomerics, Inc.

781-935-4850

77 Dragon Ct.

Woburn, MA 01888-4014

Internet: www.chomerics.com

Dow-Corning Corporation

800-248-2481

Dow-Corning Electronic Materials

2200 W. Salzburg Rd.

Midland, MI 48686-0997

Internet: www.dow.com

0.5

1.5

1020304050607080

Silicone Sheet (0.006 in.)

Bare Joint

Floroether Oil Sheet (0.007 in.)

Graphite/Oil Sheet (0.005 in.)

Synthetic Grease

Contact Pressure (psi)

MPC8241EC Datasheet(PDF) 50 Page - Freescale Semiconductor, Inc