DSPIC33FJ06GS201TESLASHMM datasheet(337/346 Pages) MICROCHIP

337 / 346 page

Preliminary

DS70318D-page 335

dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04

Section 24.0 “Electrical

Characteristics”

Updated Typical values for Thermal Packaging Characteristics (see

Table 24-3).

Updated Min and Max values for parameter DC12 (RAM Data Retention

Voltage) and added Note 4 (see Table 24-4).

Updated Characteristics for I/O Pin Input Specifications (see Table 24-9).

Added ISOURCE to I/O Pin Output Specifications (see Table 24-10).

Updated Program Memory values for parameters 136, 137, and 138

(renamed to 136a, 137a, and 138a), added parameters 136b, 137b, and

138b, and added Note 2 (see Table 24-12).

Added parameter OS42 (GM) to the External Clock Timing Requirements

(see Table 24-16).

Updated Conditions for symbol TPDLY (Tap Delay) and added symbol ACLK

(PWM Input Clock) to the High-Speed PWM Module Timing Requirements

(see Table 24-29).

Updated parameters AD01 and AD02 in the 10-bit High-Speed A/D Module

Specifications (see Table 24-36).

Updated parameters AD50b, AD55b, and AD56b, and removed parameters

AD57b and AD60b from the 10-bit High-Speed A/D Module Timing

Requirements (see Table 24-37).

TABLE A-2:

MAJOR SECTION UPDATES (CONTINUED)

Section Name

Update Description

DSPIC33FJ06GS201TE/MM Datasheet(PDF) 337 Page - Microchip Technology