9

Absolute Maximum Ratings

Parameter

Symbol

Min

Max

Units

Notes

Storage Temperature

-40

85

ºC

Lead Soldering Temperature

260

ºC

For 10 seconds, 1.8mm below

seating plane. See soldering reflow

profile in Figure 9

Supply Voltage

-0.5

3.7

V

-0.5

3.7

V

ESD (Human-body model)

2

kV

All pins

Input Voltage

-0.5

Latchup Current

20

mA

All pins

VCSEL Die Source Marking

V = A,V

V = C

Parameter (For VCSEL only)

Symbol

Min

Max

Min

Max

Units

Notes

DC Forward current

12

7.0

mA

Peak Pulsing current

19

9

mA

Duration = 100ms, 10% duty cycle

Power Dissipation

P

24

24

mW

Reverse voltage

5

8

V

I = 10μA

Laser Junction Temperature

150

170

ºC

Notes:

1. Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are the stress ratings

only and functional operation of the device at these or any other condition beyond those indicated for extended period of time may affect

device reliability.

2. The maximum ratings do not reflect eye-safe operation. Eye safe operating conditions are listed in the power adjustment procedure section.

3. The inherent design of this component causes it to be sensitive to electrostatic discharge. The ESD threshold is listed above. To prevent ESD-

induced damage, take adequate ESD precautions when handling this product.

Recommended Operating Conditions

Parameter

Symbol

Minimum

Typical

Maximum Units

Notes

Operating Temperature

040

°C

Power supply voltage

4.0

5.0

5.25

Volts

Including noise.

Power supply rise time

1

100

ms

0 to 5.0V

Supply noise (Sinusoidal)

100

mVp-p

10kHz-50MHz

Serial Port Clock Frequency

1

MHz

Active drive, 50% duty cycle

Distance from lens refe-

rence plane to surface

Z

2.18

2.40

2.62

mm

Results in +/- 0.22 mm minimum DOF.

See Figure 8.

Speed

S

30

in/sec

Acceleration

A

8

g

Load Capacitance

100

pF

MOTION, MISO

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PixArt Imaging Inc.

PixArt Imaging Inc.

ADNS-7550 Integrated Molded Lead-Frame DIP Sensor