10

Figure 8. Distance from lens reference plane to surface, Z

Sensor

Lens

Navigation Surface

Lens to Surface 2.40

Optical/Electrical Characteristics (at Tc = 5°C to 45°C):

VCSEL Die Source Marking

V = A,V

V = C

Parameter

Symbol

Min

Typ

Max

Min

Typ

Max

Units

Notes

Peak Wavelength

λ

832

865

832

865

nm

Maximum Radiant

Power

LOPmax

4.5

4.0

mW

Maximum output power

under any condition. This

is not a recommended

operating condition and

does not meet eye safety

requirements.

Wavelength

Temperature coef-

ficient

dλ/dT

0.065

0.065

nm/ºC

Wavelength

Current coefficient

dλ/dI

0.21

0.3

nm/mA

Beam Divergence

θFW@1/

e^2

15

16

deg

Threshold current

Ith

4.2

3.0

mA

Slope Efficiency

SE

0.4

0.35

W/A

Forward Voltage

VF

2.1

2.4

2.1

2.4

V

At 500uW output power

Comments:

1. VCSELs are sorted into bins as specified in the power adjustment procedure. Appropriate binning register data values are used in the application

circuit to achieve the target output power. The VCSEL binning is marked on the integrated molded lead-frame DIP sensor package.

2. When driven with current or temperature range greater than specified in the power adjustment procedure section, eye safety limits may be

exceeded. The VCSEL should then be treated as a Class IIIb laser and as a potential eye hazard.

process.

All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission.

PixArt Imaging Inc.

PixArt Imaging Inc.

ADNS-7550 Integrated Molded Lead-Frame DIP Sensor