IO96NDB2V1 datasheet(22/242 Pages) MICROSEMI

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ProASIC3L DC and Switching Characteristics

2-6

Revision 13

Thermal Characteristics

Introduction

The temperature variable in the Designer software refers to the junction temperature, not the ambient

temperature. This is an important distinction because dynamic and static power consumption cause the

chip junction temperature to be higher than the ambient temperature.

EQ 1 can be used to calculate junction temperature.

TJ = Junction Temperature = T + TA

EQ 1

where:

TA = Ambient Temperature

T = Temperature gradient between junction (silicon) and ambient T = ja * P

ja = Junction-to-ambient of the package. ja numbers are located in Table 2-5.

P = Power dissipation

Package Thermal Characteristics

The device junction-to-case thermal resistivity is

jc and the junction-to-ambient air thermal resistivity is

ja. The thermal characteristics for ja are shown for two air flow rates. The absolute maximum junction

temperature is 100°C. EQ 2 shows a sample calculation of the absolute maximum power dissipation

allowed for a 484-pin FBGA package at commercial temperature and in still air.

EQ 2

Maximum Power Allowed

Max. junction temp. (

C) Max. ambient temp. (C)

–



ja(C/W)

------------------------------------------------------------------------------------------------------------------------------------------

100

C70C

–

20.5

C/W

-------------------------------------

1.463 W

Table 2-5 •

Package Thermal Resistivities

Package Type

Device

Pin Count

jc

ja

Units

Still Air 200 ft./min.

500 ft./min.

Very Thin Quad Flat Pack (VQFP)

All devices

100

10.0

35.3

29.4

27.1

C/W

Plastic Quad Flat Pack (PQFP)

All devices

208

8.0

26.1

22.5

20.8

C/W

PQFP with embedded heatspreader

All devices

208

3.8

16.2

13.3

11.9

C/W

Fine Pitch Ball Grid Array (FBGA)

A3P250L

144

12.2

43.8

37.7

35.8

C/W

A3P600L

144

8.3

35.8

30.2

28.3

C/W

A3P1000L

144

6.3

31.6

26.2

24.2

C/W

A3P250L

256

12.0

38.6

34.7

33.0

C/W

A3P600L

256

8.5

32.0

27.5

25.8

C/W

A3P1000L

256

6.6

28.1

24.4

22.7

C/W

AGLE3000

324

TBD

C/W

A3P600L

484

9.5

27.5

21.9

20.2

C/W

A3P1000L

484

8.0

23.3

19.0

16.7

C/W

A3PE3000L

484

4.7

20.6

15.7

14.0

C/W

A3PE3000L

896

2.4

13.6

10.4

9.4

C/W

IO96NDB2V1 Datasheet(PDF) 22 Page - Microsemi Corporation

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