TAS5548DCAR datasheet(6/116 Pages) TI1

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TAS5548

SLES270A – NOVEMBER 2012 – REVISED APRIL 2015

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6 Specifications

6.1 Absolute Maximum Ratings

(1)

MIN

MAX

UNIT

Supply voltage, DVDD1 and DVDD2

–0.3

3.9

Supply voltage, AVDD and AVDD_PWM

–0.3

3.9

3.3-V digital input

–0.5

DVDD +

0.5

Input voltage

5-V tolerant(2) digital input

–0.5

IIK

Input clamp current (VI < 0 or VI > 1.8 V

±20

μA

IOK

Output clamp current (VO < 0 or VO > 1.8 V)

±20

μA

TSTG

Storage temperature range

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only. Functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions are not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

5-V tolerant signals are RESET, PDN, MUTE, HP_SEL, SCLK, LRCLK, MCLK, SDIN1, SDIN2, SDIN3, SDIN4, SDA, and SCL.

6.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001,

±250

all pins (1)

V(ESD)

Electrostatic discharge

Charged device model (CDM), per JEDEC specification

±1000

JESD22-C101, all pins (2)

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over 0°C to 85°C

MIN

NOM

MAX

UNIT

Digital supply voltage, DVDD1 and DVDD2

3.3

3.6

Analog supply voltage, AVDD and AVDD_PWM

3.3

3.6

3.3 V

VIH

High-level input voltage

5-V tolerant

1.8-V LVCMOS (XTL_IN)

1.26

3.3 V

0.8

VIL

Low-level input voltage

5-V tolerant

0.8

1.8-V (XTL_IN)

0.54

Operating ambient-air temperature

°C

Operating junction temperature

105

°C

6.4 Thermal Information

TAS5548

THERMAL METRIC(1)

DCA (HTSSOP)

UNIT

56 PINS

RθJA

Junction-to-ambient thermal resistance

26.1

RθJCtop

Junction-to-case (top) thermal resistance

13.0

RθJB

Junction-to-board thermal resistance

8.0

°C/W

ψJT

Junction-to-top characterization parameter

0.4

ψJB

Junction-to-board characterization parameter

7.9

RθJCbot

Junction-to-case (bottom) thermal resistance

0.4

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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