UT700 datasheet(43/46 Pages) AEROFLEX

Part #	UT700

Description	UT700 32-bit Fault-Tolerant SPARCTM V8/LEON 3FT Processor

PDF	46 Pages

Scroll/Zoom	100%

Manufacturer	AEROFLEX [Aeroflex Circuit Technology]

Direct Link	http://www.aeroflex.com

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43 / 46 page

36-00-00-000

Ver. 1.3.1

Aeroflex Microelectronics Solutions - HiRel

7.0 Ordering Information

UT700 LEON 3FT

Package Option

Associated Lead Finish

(Z) 484-CLGA

(S) 484-CCGA

(A) Hot Solder Dipped

Lead Finish: (NOTE 1)

(C)

Gold

(A) =

Hot Solder Dipped or Tinned

Screening Level: (NOTE 2 & 3)

(P)

Prototype (Temperature Range: 25oC only)

(E)

HiRel (Temperature Range: -55

oC to +105oC)

Case Outline:

(Z)

484-Ceramic Land Grid Array

(S)

484-Ceramic Column Grid Array

(C)

484-Ceramic Ball Grid Array

UT700 32-bit LEON 3FT

UT700 -

Notes:

1. Lead finish (A or C) must be specified.

2. Prototype Flow per Aeroflex Manufacturing Flows Document. Devices are tested at 25oC only. Radiation is neither tested nor guaranteed.

3. HiRel Flow per Aeroflex Manufacturing Flows Document. Radiation is neither tested nor guaranteed.

UT700 Datasheet(PDF) 43 Page - Aeroflex Circuit Technology