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LAN8742Ai-CZ Datasheet(PDF) 118 Page - Microchip Technology

Part # LAN8742Ai-CZ
Description  Small Footprint RMII 10/100 Ethernet Transceiver with HP Auto-MDIX and flexPWR짰 Technology
PDF  124 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

LAN8742Ai-CZ Datasheet(HTML) 118 Page - Microchip Technology

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LAN8742A/LAN8742Ai
DS00001989A-page 118
 2013-2015 Microchip Technology Inc.
RECOMMENDED LAND PATTERN
Dimension Limits
Units
C2
Optional Center Pad Width
Contact Pad Spacing
Optional Center Pad Length
Contact Pitch
Y2
X2
2.60
2.60
MILLIMETERS
0.50 BSC
MIN
E
MAX
3.90
Contact Pad Length (X24)
Contact Pad Width (X24)
Y1
X1
0.85
0.30
Microchip Technology Drawing C04-2143A S4QFN
NOM
24-Lead Very Thin Plastic Quad Flat, No Lead Package (MJ) – 4x4x0.9 mm Body [VQFN]
SILK SCREEN
1
2
24
C1
C2
E
X1
Y1
G1
Y2
X2
C1
Contact Pad Spacing
3.90
Contact Pad to Center Pad (X24)
G1
0.23
Thermal Via Diameter
V
Thermal Via Pitch
EV
0.30
1.00
ØV
EV
EV
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
SMSC Legacy S4QFN
G2
Contact Pad to Contact Pad (X20)
G2
0.20



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