MSP430F423IPM datasheet(10/59 Pages) TI1

10 / 59 page

MSP430F427, MSP430F425, MSP430F423

SLAS421B – APRIL 2004 – REVISED NOVEMBER 2016

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Specifications

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages referenced to VSS.The JTAG fuse-blow voltage, VFB, is allowed to exceed the absolute maximum rating. The voltage is

applied to the TDI/TCLK pin when blowing the JTAG fuse.

Specifications

5.1

Absolute Maximum Ratings

(1)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Voltage applied at VCC to VSS

–0.3

4.1

Voltage applied to any pin(2)

–0.3

VCC + 0.3

Diode current at any device terminal

±2

Storage temperature range, Tstg

Unprogrammed device

–55

150

°C

Programmed device

–40

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Pins listed as

±1000 V may actually have higher performance.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Pins listed as ±250 V

may actually have higher performance.

5.2

ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±1000

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±250

(1)

TI recommends powering AVCC and DVCC from the same source. A maximum difference of 0.3 V between AVCC and DVCC can be

tolerated during power up and operation.

(2)

The minimum operating supply voltage is defined according to the trip point where POR is going active by decreasing the supply

voltage. POR is going inactive when the supply voltage is raised above the minimum supply voltage plus the hysteresis of the SVS

circuitry.

(3)

In LF mode, the LFXT1 oscillator requires a watch crystal.

5.3

Recommended Operating Conditions

Typical values are specified at VCC = 3.3 V and TA = 25°C (unless otherwise noted)

MIN

NOM

MAX

UNIT

VCC

Supply voltage during program

execution(1) (AVCC = DVCC = VCC)

SD16 disabled

1.8

3.6

SVS enabled, PORON = 1(2), SD16 disabled

2.0

3.6

SD16 enabled or during programming of flash

memory

2.7

3.6

VSS

Supply voltage (AVSS = DVSS = VSS)

Operating free-air temperature range

–40

°C

f(LFXT1)

LFXT1 crystal frequency(3)

LF selected, XTS_FLL = 0

Watch crystal

32.768

kHz

XT1 selected, XTS_FLL = 1

Ceramic resonator

450

8000

XT1 selected, XTS_FLL = 1

Crystal

1000

8000

f(System)

Processor frequency (signal

MCLK) (also see Figure 5-1)

VCC = 1.8 V

4.15

MHz

VCC = 3.6 V

MSP430F423IPM Datasheet(PDF) 10 Page - Texas Instruments

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