CS4399 datasheet(108/111 Pages) CIRRUS

108 / 111 page

108

DS1113F1

CS4399

10 Package Dimensions

10.1 40-Pin QFN Package Dimensions

Figure 10-1. 40-Pin QFN Package Drawing

Table 10-1. 40-Pin QFN Package Dimensions

Description

Dim

Millimeters

Minimum

Nominal

Maximum

Total thickness

0.70.750.8

Stand off

0.035

0.05

Mold thickness

—

0.55

—

L/F thickness

0.203 REF

Lead width

0.15

0.2

0.25

Body size

5 BSC

Lead pitch

0.4 BSC

EP size

3.4

3.5

3.6

3.4

3.5

3.6

Lead length

0.35

0.4

0.45

Package edge tolerance

aaa

0.1

Mold flatness

bbb

0.1

Coplanarity

ccc

0.08

Lead offset

ddd

0.1

Exposed pad offset

eee

0.1

Notes:

• Dimensioning and tolerances per ASME Y 14.5M–1995.

• X/Y Dimensions are estimates.

• The Ball 1 location indicator shown above is for illustration purposes only and may not be to scale.

• Dimensioning and tolerances per ASME Y 14.5M–1994.

• Dimension “b” applies to the solder sphere diameter and is measured at the midpoint between the

package body and the seating plane.

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