CS4399 datasheet(110/111 Pages) CIRRUS

110 / 111 page

110

DS1113F1

CS4399

11 Thermal Characteristics

Notes:

• Natural convection at the maximum recommended operating temperature TA (see Table 3-2)

• Four-layer, 2s2p PCB as specified by JESD51-9 and JESD51-11; dimensions: 101.5 x 114.5 x 1.6 mm

• Thermal parameters as defined by JESD51-12

12 Ordering Information

13 References

• NXP Semiconductors, The I2C-Bus Specification and User Manual (UM10204). http://www.nxp.com/

14 Revision History

Table 11-1. Typical JEDEC Four-Layer, 2s2p Board Thermal Characteristics

Parameter

Symbol

WLCSP

QFN

Units

Junction-to-ambient thermal resistance

JA

42.3

32.7

°C/W

Junction-to-board thermal resistance

JB

11.1

8.8

°C/W

Junction-to-case thermal resistance

JC

0.22

0.92

°C/W

Junction-to-board thermal-characterization parameter

JB

11.0

8.8

°C/W

Junction-to-package-top thermal-characterization parameter

JT

0.09

0.23

°C/W

Table 12-1. Ordering Information

Product

Description

Package

Halogen

Free

Pb Free

Grade

Temperature

Range

Container

Order Number

CS4399 130-dB, 32-Bit

High-Performance DAC

42-ball

WLCSP

Yes

Commercial –10°C to +70°C Tape and Reel

CS4399-CWZR

40-pin

QFN

Yes

Commercial –10°C to +70°C

Tray

CS4399-CNZ

Tape and Reel

CS4399-CNZR

Table 14-1. Revision History

Revision

Changes

DEC ‘16

Initial release

Important: Please check with your Cirrus Logic sales representative to confirm that you are using the latest revision of this document and to

determine whether there are errata associated with this device.

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