DAP018A/B/C/D/F

http://onsemi.com

5

MAXIMUM RATINGS TABLE

Symbol

Rating

Value

Unit

VCCmax

Maximum Power Supply Voltage, VCC Pin, Continuous Voltage

−0.3 to 28

V

ICCmax

Maximum Current for VCC Pin

$30

mA

Maximum Voltage on Low Power Pins (Except Pins 9, 10 and 14)

−0.3 to 10

V

IOPP

Maximum Injected Negative Current into the OPP Pin (Pin 1)

−2

mA

RθJ−A

Thermal Resistance Junction−to−Air

120

°C/W

TJMAX

Maximum Junction Temperature

150

°C

Storage Temperature Range

−60 to +150

°C

ESD Capability, Human Body Model (All pins except HV)

2

kV

ESD Capability, Machine Model

180

V

Maximum Voltage on Pin 14 (HV)

−0.3 to 500

V

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

NOTES:This device(s) contains ESD protection and exceeds the following tests:

Human Body Model 2000V per JEDEC Standard JESD22−A114E

Machine Model 200V per JEDEC Standard JESD22−A115−A

This device contains latch−up protection and exceeds 100 mA per JEDEC Standard JESD78 except pin 12.

ELECTRICAL CHARACTERISTICS

(For typical values TJ = 25°C, for min/max values TJ = −25°C to +125°C, Max TJ = 150°C, VCC = 12 V unless otherwise noted)

Symbol

Rating

Pin

Min

Typ

Max

Unit

SUPPLY SECTION

VCCON

VCC increasing level at which the current source turns−off

10

14

15

16

V

VCC(min) VCC level below which output pulses are stopped

10

8

9

10

V

VCClatch VCC decreasing level at which the latch−off phase ends

10

7.2

7.5

8.0

V

VCCreset Internal latch reset level

10

5

V

resetHyst

Minimum voltage difference between VCClatch and VCCreset, TJ > 0°C

−

0.8

V

VCCTSD

VCC voltage when the TSD is activated (Note 2)

−

6.5

7.1

V

ICC1

Internal IC consumption, no output load on pin 9

10

1.9

mA

ICC1light

ICC1 for a feedback voltage equal to Vfold (internal bias reduction)

10

1.5

mA

ICC2

Internal IC consumption, 1 nF output load on pin 9

10

2.7

mA

ICC3

Internal IC consumption, latch−off phase

10

0.6

mA

ITSD

Current consumption in TSD mode

−

400

mA

INTERNAL START−UP CURRENT SOURCE – High−voltage pin biased to 60 Vdc.

Symbol

Rating

Pin

Min

Typ

Max

Unit

IC2

High−voltage current source, VCC = 10 V

14

3

6

9

mA

IC1

High−voltage current source, VCC = 0, TJ = 25°C

14

150

650

1200

mA

VTh

VCC transition level for IC1 to IC2 toggling point

14

0.9

V

Ileak

Leakage current for the high voltage source,

Vpin 14 = 500 Vdc, VCC = 12 V, TJ > 0°C

14

1

15

30

mA

DRIVE OUTPUT

Symbol

Rating

Pin

Min

Typ

Max

Unit

Tr

Output voltage rise−time @ CL = 1 nF, 10−90% of a 12 V output signal

9

−

40

−

ns

1. See characterization table for linearity over negative bias voltage.

2. Guaranteed by design.

3. The OTP parameters are selected to cope with a TTC03−474 which offers a resistance of 8.8 kW when heated to a temperature of 110°C.

4. The brown−out circuitry is disabled on versions A & C and operates on versions B & D.