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PC7447 Datasheet(PDF) 38 Page - ATMEL Corporation |
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PC7447 Datasheet(HTML) 38 Page - ATMEL Corporation |
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38 / 66 page ![]() 38 PC7457/47 [Preliminary] 5345B–HIREL–02/04 Package Mechanical Data The following sections provide the package parameters and mechanical dimensions for the CBGA package. Package Parameters for the PC7447, 360 CBGA The package parameters are as provided in the following list. The package type is 25 × 25 mm, 360-lead ceramic ball grid array (CBGA). Package outline 25 mm × 25 mm Interconnects 360 (19 × 19 ball array - 1) Pitch 1.27 mm (50 mil) Minimum module height 2.72 mm Maximum module height 3.24 mm Ball diameter 0.89 mm (35 mil) |
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